Thermal energy harvesting

M. Mouis, E. Chávez-Ángel, C. Sotomayor-Torres, F. Alzina, M.V. Costache, A.G. Nassiopoulou, K. Valalaki, E. Hourdakis, S.O. Valenzuela, B., Viala, D. Zakharov, A. Shchepetov, J. Ahopelto

    Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

    4 Citations (Scopus)

    Abstract

    This chapter presents some recent advances in the field of thermal energy harvesting, starting with thermoelectric energy harvesting, with a focus on the prospects of materials nanostructuration. Research toward alternative solutions will also be presented. Thermoelectric (TE) conversion is the most straightforward method to convert thermal energy into electrical energy, able to power such systems as autonomous sensor networks. Raman thermometry offers particular advantages for a fast and contactless determination of the thermal conductivity. The highly porous Si material is nanostructured and has the properties of confined systems, including a very low thermal conductivity. The chapter explores an alternative route for thermal energy harvesting (TEH) with composites using the mechanical coupling between a thermal shape memory alloy (SMA) and a piezoelectric material.
    Original languageEnglish
    Title of host publicationBeyond-CMOS Nanodevices 1
    PublisherWiley
    Pages135-219
    ISBN (Print)9781848216549, 9781118984772
    DOIs
    Publication statusPublished - 2014
    MoE publication typeD2 Article in professional manuals or guides or professional information systems or text book material

    Keywords

    • piezoelectric materials
    • porous silicon
    • Raman thermometry
    • thermal energy harvesting (TEH)
    • thermal shape memory alloy (SMA)
    • thermoelectric (TE) conversion

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  • Cite this

    Mouis, M., Chávez-Ángel, E., Sotomayor-Torres, C., Alzina, F., Costache, M. V., Nassiopoulou, A. G., Valalaki, K., Hourdakis, E., Valenzuela, S. O., Viala, B. ., Zakharov, D., Shchepetov, A., & Ahopelto, J. (2014). Thermal energy harvesting. In Beyond-CMOS Nanodevices 1 (pp. 135-219). Wiley. https://doi.org/10.1002/9781118984772.ch7