Abstract
The fatigue behaviour of solder joints in ceramic LTCC modules on FR-4 boards was investigated using thermal fatigue experiments at temperature intervals of 0–100°C and −40 – 125°C, and non-destructive and SEM/EDS investigations of thermally cycled modules. Dissolution reactions and formation of tin-based intermetallics were encountered in the joints and found to cause degradation in them. A high peak reflow temperature in the fabrication of modules had a detrimental effect on performance. Vias filled with silver located under the central regions of the solder pads of the LTCC modules enhanced the reliability of the solder joints.
| Original language | English |
|---|---|
| Pages (from-to) | 1527-1532 |
| Journal | Microelectronics Reliability |
| Volume | 40 |
| Issue number | 8-10 |
| DOIs | |
| Publication status | Published - 2000 |
| MoE publication type | A1 Journal article-refereed |
| Event | 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Dresden, Germany Duration: 2 Oct 2000 → 6 Oct 2000 |
Keywords
- solder joint