Thermal fatigue and metallurgical reactions in solder joints of LTCC modules

Keyphrases

• Thermal Fatigue 100%
• Solder Joint 100%
• LTCC Modules 100%
• Metallurgical Reaction 100%
• Highest Peak 33%
• Non-destructive 33%
• Detrimental Effects 33%
• SEM-EDS 33%
• FR-4 33%
• Effect on Performance 33%
• Fatigue Behavior 33%
• Fatigue Experiment 33%
• Dissolution Reaction 33%
• Temperature Interval 33%
• Central Region 33%
• Intermetallics 33%
• Reflow Temperature 33%
• Solder Pads 33%
• Tin-based 33%

INIS

• thermal fatigue 100%
• performance 50%
• scanning electron microscopy 50%
• ceramics 50%
• peaks 50%
• dissolution 50%
• silver 50%
• investigations 50%
• reliability 50%
• fatigue 50%
• fabrication 50%
• intermetallic compounds 50%
• tin 50%
• central region 50%

Material Science

• Low Temperature Co-Fired Ceramics 100%
• Solder Joint 100%
• Thermal Fatigue 100%
• Scanning Electron Microscopy 33%
• Energy-Dispersive X-Ray Spectroscopy 33%
• Fatigue Behavior 33%
• Tin 33%
• Intermetallics 33%