Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules

Risto Rautioaho, Olli Nousiainen, Seppo Leppävuori, Jaakko Lenkkeri, Tuomo Jaakola

Research output: Contribution to journalArticleScientificpeer-review

13 Citations (Scopus)

Abstract

The fatigue behaviour of joints between ceramic LTCC modules and FR-4 boards was investigated using thermal cycling tests at temperature intervals of 0 degreesC - 100 degreesC and -40 degreesC - 125 degreesC and analysis of the cycled modules using scanning acoustic microscopy and SEM/EDS. The assemblies were fabricated with Ag-Pd and Ag-Pt metallized pads on LTCC. Fatigue cracks initiated in the solder region of the Ag-Pd metallized LTCC modules, but propagated later in the ceramic module. Propagation was remarkably retarded by Ag-filled vias located under the pads on LTCC. The final cracks that caused an electrical failure in the modules crossed the root region of the vias along the thick Ag(3)Sn+PdSn(4) layer located in this region. The joints of the Ag-Pt metallized modules passed the resistance measurement in both tests. However, they also showed crack growth that initiated on the LTCC/metallization interface, propagated in the ceramic, but was retarded by the vias. These vias were resistant to fracture, since only a thin Ag(3)Sn layer (approximate to 1 mum) existed in their root region.
Original languageEnglish
Pages (from-to)1643-1648
Number of pages6
JournalMicroelectronics Reliability
Volume41
Publication statusPublished - 2001
MoE publication typeA1 Journal article-refereed
EventESREF 2001. Arcachon, FR, 1 - 5 Oct. 2001 -
Duration: 1 Jan 2001 → …

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thermal fatigue
Thermal fatigue
Thermal cycling
solders
Metallizing
Soldering alloys
Energy dispersive spectroscopy
Crack propagation
modules
Fatigue of materials
Cracks
Scanning electron microscopy
cracks
ceramics
Temperature
thermal cycling tests
assemblies
Fatigue cracks
Acoustic Microscopy
microscopy

Cite this

Rautioaho, R., Nousiainen, O., Leppävuori, S., Lenkkeri, J., & Jaakola, T. (2001). Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules. Microelectronics Reliability, 41, 1643-1648.
Rautioaho, Risto ; Nousiainen, Olli ; Leppävuori, Seppo ; Lenkkeri, Jaakko ; Jaakola, Tuomo. / Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules. In: Microelectronics Reliability. 2001 ; Vol. 41. pp. 1643-1648.
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abstract = "The fatigue behaviour of joints between ceramic LTCC modules and FR-4 boards was investigated using thermal cycling tests at temperature intervals of 0 degreesC - 100 degreesC and -40 degreesC - 125 degreesC and analysis of the cycled modules using scanning acoustic microscopy and SEM/EDS. The assemblies were fabricated with Ag-Pd and Ag-Pt metallized pads on LTCC. Fatigue cracks initiated in the solder region of the Ag-Pd metallized LTCC modules, but propagated later in the ceramic module. Propagation was remarkably retarded by Ag-filled vias located under the pads on LTCC. The final cracks that caused an electrical failure in the modules crossed the root region of the vias along the thick Ag(3)Sn+PdSn(4) layer located in this region. The joints of the Ag-Pt metallized modules passed the resistance measurement in both tests. However, they also showed crack growth that initiated on the LTCC/metallization interface, propagated in the ceramic, but was retarded by the vias. These vias were resistant to fracture, since only a thin Ag(3)Sn layer (approximate to 1 mum) existed in their root region.",
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Rautioaho, R, Nousiainen, O, Leppävuori, S, Lenkkeri, J & Jaakola, T 2001, 'Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules', Microelectronics Reliability, vol. 41, pp. 1643-1648.

Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules. / Rautioaho, Risto; Nousiainen, Olli; Leppävuori, Seppo; Lenkkeri, Jaakko; Jaakola, Tuomo.

In: Microelectronics Reliability, Vol. 41, 2001, p. 1643-1648.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules

AU - Rautioaho, Risto

AU - Nousiainen, Olli

AU - Leppävuori, Seppo

AU - Lenkkeri, Jaakko

AU - Jaakola, Tuomo

PY - 2001

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N2 - The fatigue behaviour of joints between ceramic LTCC modules and FR-4 boards was investigated using thermal cycling tests at temperature intervals of 0 degreesC - 100 degreesC and -40 degreesC - 125 degreesC and analysis of the cycled modules using scanning acoustic microscopy and SEM/EDS. The assemblies were fabricated with Ag-Pd and Ag-Pt metallized pads on LTCC. Fatigue cracks initiated in the solder region of the Ag-Pd metallized LTCC modules, but propagated later in the ceramic module. Propagation was remarkably retarded by Ag-filled vias located under the pads on LTCC. The final cracks that caused an electrical failure in the modules crossed the root region of the vias along the thick Ag(3)Sn+PdSn(4) layer located in this region. The joints of the Ag-Pt metallized modules passed the resistance measurement in both tests. However, they also showed crack growth that initiated on the LTCC/metallization interface, propagated in the ceramic, but was retarded by the vias. These vias were resistant to fracture, since only a thin Ag(3)Sn layer (approximate to 1 mum) existed in their root region.

AB - The fatigue behaviour of joints between ceramic LTCC modules and FR-4 boards was investigated using thermal cycling tests at temperature intervals of 0 degreesC - 100 degreesC and -40 degreesC - 125 degreesC and analysis of the cycled modules using scanning acoustic microscopy and SEM/EDS. The assemblies were fabricated with Ag-Pd and Ag-Pt metallized pads on LTCC. Fatigue cracks initiated in the solder region of the Ag-Pd metallized LTCC modules, but propagated later in the ceramic module. Propagation was remarkably retarded by Ag-filled vias located under the pads on LTCC. The final cracks that caused an electrical failure in the modules crossed the root region of the vias along the thick Ag(3)Sn+PdSn(4) layer located in this region. The joints of the Ag-Pt metallized modules passed the resistance measurement in both tests. However, they also showed crack growth that initiated on the LTCC/metallization interface, propagated in the ceramic, but was retarded by the vias. These vias were resistant to fracture, since only a thin Ag(3)Sn layer (approximate to 1 mum) existed in their root region.

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Rautioaho R, Nousiainen O, Leppävuori S, Lenkkeri J, Jaakola T. Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules. Microelectronics Reliability. 2001;41:1643-1648.