Thermal isolation through nanostructuring

D. Leadley, V. Shah, Jouni Ahopelto, Andrey Shchepetov, Mika Prunnila, et al

    Research output: Chapter in Book/Report/Conference proceedingChapter or book articleProfessional

    Abstract

    This chapter discusses the cooling of a platform, which requires the electronic coolers to extract heat by coupling to phonons within the platform material. Major results obtained within the nanofunction NoE on the development of nanomodulated magnetic materials and the investigation of their main properties are also presented. The cooling power of the devices becomes paramount, as opposed to the base temperature that could be reached, and must exceed heat leaks into the platform from the surroundings. This indirect cooling is desirable for systems where electrical isolation from the refrigeration elements is required, such as in quantum information applications or superconducting transition edge sensors (TESs). Thick porous Si layers on the Si wafer constitute alternative structures that could replace the rather fragile silicon nitride membranes for use as thermal isolation platforms. The structure and morphology of porous Si determines its electrical and thermal conductivity.
    Original languageEnglish
    Title of host publicationBeyond-CMOS Nanodevices 1
    PublisherWiley
    Pages331-363
    ISBN (Print)978-111898477-2, 978-184821654-9
    DOIs
    Publication statusPublished - 2014
    MoE publication typeD2 Article in professional manuals or guides or professional information systems or text book material

    Keywords

    • crystalline materials;
    • electronic coolers;
    • nanostructured porous Si layers;
    • nanostructuring;
    • thermal conductivity;
    • thermal isolation

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  • Cite this

    Leadley, D., Shah, V., Ahopelto, J., Shchepetov, A., Prunnila, M., & al, E. (2014). Thermal isolation through nanostructuring. In Beyond-CMOS Nanodevices 1 (pp. 331-363). Wiley. https://doi.org/10.1002/9781118984772.ch12