Thermal management and thermomechanical reliability of LTCC module for RF band

Eveliina Juntunen, Jaakko Lenkkeri

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	Elektroniikan valmistus 2005
Pages	118–124
Publication status	Published - 2005
MoE publication type	B3 Non-refereed article in conference proceedings
Event	Elektroniikan tuotanto- ja pakkaustekniikan konferenssi, ELTUPAK 2005 - Pori, Finland Duration: 19 May 2005 → 20 May 2005

Conference	Elektroniikan tuotanto- ja pakkaustekniikan konferenssi, ELTUPAK 2005
Country/Territory	Finland
City	Pori
Period	19/05/05 → 20/05/05

Cite this

@inproceedings{e0bd9f8c288a4fce96b55913ab1dc746,

title = "Thermal management and thermomechanical reliability of LTCC module for RF band",

author = "Eveliina Juntunen and Jaakko Lenkkeri",

year = "2005",

language = "English",

pages = "118–124",

booktitle = "Elektroniikan valmistus 2005",

note = "Elektroniikan tuotanto- ja pakkaustekniikan konferenssi, ELTUPAK 2005 ; Conference date: 19-05-2005 Through 20-05-2005",

}