Thermal management in flexible substrates for LEDs

Olli Tapaninen; Jyrki Ollila; Eveliina Juntunen; Kimmo Keränen

Thermal management in flexible substrates for LEDs

Olli Tapaninen, Jyrki Ollila, Eveliina Juntunen, Kimmo Keränen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

4 Citations (Scopus)

Abstract

Evolution of lumens per watt efficacy has enabled exponential growth in light-emitting diode (LED) lighting applications. Small size of the LED has given the opportunity to integrate light sources in luminaires of many shapes and sizes. Flexible printed circuit boards enable low cost and easily integrable modules. However thermal management becomes important as the heat load on the board increases. In this paper we compare different thermal via techniques with thermal slugs as heat management structures. We present their challenges and benefits with measurements and simulations.

Original language	English
Title of host publication	IMAPS Nordic Annual Conference 2014
Editors	Jarkko Kutilainen
Place of Publication	Oulu
Publisher	IMAPS Nordic
Pages	128-133
ISBN (Print)	978-1-63439-379-9
Publication status	Published - 2014
MoE publication type	A4 Article in a conference publication
Event	IMAPS Nordic Annual Conference 2014 - Oulu, Finland Duration: 9 Jun 2014 → 11 Jun 2014

Conference

Conference	IMAPS Nordic Annual Conference 2014
Country/Territory	Finland
City	Oulu
Period	9/06/14 → 11/06/14

Cite this

@inproceedings{85781c976f9f4098892c741454c07d83,

title = "Thermal management in flexible substrates for LEDs",

abstract = "Evolution of lumens per watt efficacy has enabled exponential growth in light-emitting diode (LED) lighting applications. Small size of the LED has given the opportunity to integrate light sources in luminaires of many shapes and sizes. Flexible printed circuit boards enable low cost and easily integrable modules. However thermal management becomes important as the heat load on the board increases. In this paper we compare different thermal via techniques with thermal slugs as heat management structures. We present their challenges and benefits with measurements and simulations.",

author = "Olli Tapaninen and Jyrki Ollila and Eveliina Juntunen and Kimmo Ker{\"a}nen",

year = "2014",

language = "English",

isbn = "978-1-63439-379-9",

pages = "128--133",

editor = "Jarkko Kutilainen",

booktitle = "IMAPS Nordic Annual Conference 2014",

publisher = "IMAPS Nordic",

address = "Finland",

note = "IMAPS Nordic Annual Conference 2014 ; Conference date: 09-06-2014 Through 11-06-2014",

}

TY - GEN

T1 - Thermal management in flexible substrates for LEDs

AU - Tapaninen, Olli

AU - Ollila, Jyrki

AU - Juntunen, Eveliina

AU - Keränen, Kimmo

PY - 2014

Y1 - 2014

N2 - Evolution of lumens per watt efficacy has enabled exponential growth in light-emitting diode (LED) lighting applications. Small size of the LED has given the opportunity to integrate light sources in luminaires of many shapes and sizes. Flexible printed circuit boards enable low cost and easily integrable modules. However thermal management becomes important as the heat load on the board increases. In this paper we compare different thermal via techniques with thermal slugs as heat management structures. We present their challenges and benefits with measurements and simulations.

AB - Evolution of lumens per watt efficacy has enabled exponential growth in light-emitting diode (LED) lighting applications. Small size of the LED has given the opportunity to integrate light sources in luminaires of many shapes and sizes. Flexible printed circuit boards enable low cost and easily integrable modules. However thermal management becomes important as the heat load on the board increases. In this paper we compare different thermal via techniques with thermal slugs as heat management structures. We present their challenges and benefits with measurements and simulations.

UR - http://toc.proceedings.com/23802webtoc.pdf

M3 - Conference article in proceedings

SN - 978-1-63439-379-9

SP - 128

EP - 133

BT - IMAPS Nordic Annual Conference 2014

A2 - Kutilainen, Jarkko

PB - IMAPS Nordic

CY - Oulu

T2 - IMAPS Nordic Annual Conference 2014

Y2 - 9 June 2014 through 11 June 2014

ER -

Thermal management in flexible substrates for LEDs

Abstract

Conference

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