Thermal management in flexible substrates for LEDs

Olli Tapaninen, Jyrki Ollila, Eveliina Juntunen, Kimmo Keränen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    4 Citations (Scopus)


    Evolution of lumens per watt efficacy has enabled exponential growth in light-emitting diode (LED) lighting applications. Small size of the LED has given the opportunity to integrate light sources in luminaires of many shapes and sizes. Flexible printed circuit boards enable low cost and easily integrable modules. However thermal management becomes important as the heat load on the board increases. In this paper we compare different thermal via techniques with thermal slugs as heat management structures. We present their challenges and benefits with measurements and simulations.
    Original languageEnglish
    Title of host publicationIMAPS Nordic Annual Conference 2014
    EditorsJarkko Kutilainen
    Place of PublicationOulu
    PublisherIMAPS Nordic
    ISBN (Print)978-1-63439-379-9
    Publication statusPublished - 2014
    MoE publication typeA4 Article in a conference publication
    EventIMAPS Nordic Annual Conference 2014 - Oulu, Finland
    Duration: 9 Jun 201411 Jun 2014


    ConferenceIMAPS Nordic Annual Conference 2014


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