Thermal management materials in electronics

Mika Kolari, Tommi Varis, Erja Rajamäki, Jari Keskinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Abstract

Thermal management materials are widely used in electronics to facilitate the conduction of heat from components to the surrounding area. This group of materials is very large, including, e.g., metal cooling elements, greases, adhesives, phase change materials, and elastic pads. These materials can replace other cooling techniques, such as fans. In many cases the material solution is preferred because heat conduction is a more effective way to manage heating problems than techniques based on convection. In this research project, two material groups were chosen for development: heat-conductive gel composites and ceramic coatings. Both of these offer good heat conduction combined with electrical insulation. Heat-conductive gels and gel composites can be applied on components and circuit boards that need cooling. Gels fill air gaps between hot components and cooling material, thus improving heat conduction. Ceramic coatings can be used as heat-conducting and electrically insulating substrates in power electronics. These applications are extremely demanding due to the necessity of resistance against high temperatures, mechanical compression, and very high electrical resistance.
Original languageEnglish
Title of host publicationMechanics for electronics
Subtitle of host publicationVTT Research programme 2000 - 2002
Place of PublicationEspoo
PublisherVTT Technical Research Centre of Finland
Pages27-38
ISBN (Electronic)951-38-5737-9
ISBN (Print)951-38-5736-0
Publication statusPublished - 2002
MoE publication typeB3 Non-refereed article in conference proceedings
EventMechanics for Electronics
: VTT Research Programme 2000–2002
- Espoo, Finland
Duration: 4 Dec 20024 Dec 2002

Publication series

SeriesVTT Symposium
Number223
ISSN0357-9387

Seminar

SeminarMechanics for Electronics
CountryFinland
CityEspoo
Period4/12/024/12/02

Fingerprint

Electronic equipment
Gels
Heat conduction
Cooling
Ceramic coatings
Heat problems
Acoustic impedance
Phase change materials
Composite coatings
Lubricating greases
Power electronics
Chemical elements
Fans
Insulation
Adhesives
Thermal management (electronics)
Hot Temperature
Networks (circuits)
Composite materials
Substrates

Keywords

  • tolerance analysis methods
  • assembly modelling
  • assembly process and equipment design
  • digital plant technologies

Cite this

Kolari, M., Varis, T., Rajamäki, E., & Keskinen, J. (2002). Thermal management materials in electronics. In Mechanics for electronics: VTT Research programme 2000 - 2002 (pp. 27-38). Espoo: VTT Technical Research Centre of Finland. VTT Symposium, No. 223
Kolari, Mika ; Varis, Tommi ; Rajamäki, Erja ; Keskinen, Jari. / Thermal management materials in electronics. Mechanics for electronics: VTT Research programme 2000 - 2002. Espoo : VTT Technical Research Centre of Finland, 2002. pp. 27-38 (VTT Symposium; No. 223).
@inproceedings{f7cd0fb360b848f3b92f284a9eeb1d1c,
title = "Thermal management materials in electronics",
abstract = "Thermal management materials are widely used in electronics to facilitate the conduction of heat from components to the surrounding area. This group of materials is very large, including, e.g., metal cooling elements, greases, adhesives, phase change materials, and elastic pads. These materials can replace other cooling techniques, such as fans. In many cases the material solution is preferred because heat conduction is a more effective way to manage heating problems than techniques based on convection. In this research project, two material groups were chosen for development: heat-conductive gel composites and ceramic coatings. Both of these offer good heat conduction combined with electrical insulation. Heat-conductive gels and gel composites can be applied on components and circuit boards that need cooling. Gels fill air gaps between hot components and cooling material, thus improving heat conduction. Ceramic coatings can be used as heat-conducting and electrically insulating substrates in power electronics. These applications are extremely demanding due to the necessity of resistance against high temperatures, mechanical compression, and very high electrical resistance.",
keywords = "tolerance analysis methods, assembly modelling, assembly process and equipment design, digital plant technologies",
author = "Mika Kolari and Tommi Varis and Erja Rajam{\"a}ki and Jari Keskinen",
year = "2002",
language = "English",
isbn = "951-38-5736-0",
series = "VTT Symposium",
publisher = "VTT Technical Research Centre of Finland",
number = "223",
pages = "27--38",
booktitle = "Mechanics for electronics",
address = "Finland",

}

Kolari, M, Varis, T, Rajamäki, E & Keskinen, J 2002, Thermal management materials in electronics. in Mechanics for electronics: VTT Research programme 2000 - 2002. VTT Technical Research Centre of Finland, Espoo, VTT Symposium, no. 223, pp. 27-38, Mechanics for Electronics
, Espoo, Finland, 4/12/02.

Thermal management materials in electronics. / Kolari, Mika; Varis, Tommi; Rajamäki, Erja; Keskinen, Jari.

Mechanics for electronics: VTT Research programme 2000 - 2002. Espoo : VTT Technical Research Centre of Finland, 2002. p. 27-38 (VTT Symposium; No. 223).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

TY - GEN

T1 - Thermal management materials in electronics

AU - Kolari, Mika

AU - Varis, Tommi

AU - Rajamäki, Erja

AU - Keskinen, Jari

PY - 2002

Y1 - 2002

N2 - Thermal management materials are widely used in electronics to facilitate the conduction of heat from components to the surrounding area. This group of materials is very large, including, e.g., metal cooling elements, greases, adhesives, phase change materials, and elastic pads. These materials can replace other cooling techniques, such as fans. In many cases the material solution is preferred because heat conduction is a more effective way to manage heating problems than techniques based on convection. In this research project, two material groups were chosen for development: heat-conductive gel composites and ceramic coatings. Both of these offer good heat conduction combined with electrical insulation. Heat-conductive gels and gel composites can be applied on components and circuit boards that need cooling. Gels fill air gaps between hot components and cooling material, thus improving heat conduction. Ceramic coatings can be used as heat-conducting and electrically insulating substrates in power electronics. These applications are extremely demanding due to the necessity of resistance against high temperatures, mechanical compression, and very high electrical resistance.

AB - Thermal management materials are widely used in electronics to facilitate the conduction of heat from components to the surrounding area. This group of materials is very large, including, e.g., metal cooling elements, greases, adhesives, phase change materials, and elastic pads. These materials can replace other cooling techniques, such as fans. In many cases the material solution is preferred because heat conduction is a more effective way to manage heating problems than techniques based on convection. In this research project, two material groups were chosen for development: heat-conductive gel composites and ceramic coatings. Both of these offer good heat conduction combined with electrical insulation. Heat-conductive gels and gel composites can be applied on components and circuit boards that need cooling. Gels fill air gaps between hot components and cooling material, thus improving heat conduction. Ceramic coatings can be used as heat-conducting and electrically insulating substrates in power electronics. These applications are extremely demanding due to the necessity of resistance against high temperatures, mechanical compression, and very high electrical resistance.

KW - tolerance analysis methods

KW - assembly modelling

KW - assembly process and equipment design

KW - digital plant technologies

M3 - Conference article in proceedings

SN - 951-38-5736-0

T3 - VTT Symposium

SP - 27

EP - 38

BT - Mechanics for electronics

PB - VTT Technical Research Centre of Finland

CY - Espoo

ER -

Kolari M, Varis T, Rajamäki E, Keskinen J. Thermal management materials in electronics. In Mechanics for electronics: VTT Research programme 2000 - 2002. Espoo: VTT Technical Research Centre of Finland. 2002. p. 27-38. (VTT Symposium; No. 223).