Thermal management materials in electronics

Mika Kolari, Tommi Varis, Erja Rajamäki, Jari Keskinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Abstract

Thermal management materials are widely used in electronics to facilitate the conduction of heat from components to the surrounding area. This group of materials is very large, including, e.g., metal cooling elements, greases, adhesives, phase change materials, and elastic pads. These materials can replace other cooling techniques, such as fans. In many cases the material solution is preferred because heat conduction is a more effective way to manage heating problems than techniques based on convection. In this research project, two material groups were chosen for development: heat-conductive gel composites and ceramic coatings. Both of these offer good heat conduction combined with electrical insulation. Heat-conductive gels and gel composites can be applied on components and circuit boards that need cooling. Gels fill air gaps between hot components and cooling material, thus improving heat conduction. Ceramic coatings can be used as heat-conducting and electrically insulating substrates in power electronics. These applications are extremely demanding due to the necessity of resistance against high temperatures, mechanical compression, and very high electrical resistance.
Original languageEnglish
Title of host publicationMechanics for electronics
Subtitle of host publicationVTT Research programme 2000 - 2002
Place of PublicationEspoo
PublisherVTT Technical Research Centre of Finland
Pages27-38
ISBN (Electronic)951-38-5737-9
ISBN (Print)951-38-5736-0
Publication statusPublished - 2002
MoE publication typeB3 Non-refereed article in conference proceedings
EventMechanics for Electronics
: VTT Research Programme 2000–2002
- Espoo, Finland
Duration: 4 Dec 20024 Dec 2002

Publication series

SeriesVTT Symposium
Number223
ISSN0357-9387

Seminar

SeminarMechanics for Electronics
CountryFinland
CityEspoo
Period4/12/024/12/02

Keywords

  • tolerance analysis methods
  • assembly modelling
  • assembly process and equipment design
  • digital plant technologies

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  • Cite this

    Kolari, M., Varis, T., Rajamäki, E., & Keskinen, J. (2002). Thermal management materials in electronics. In Mechanics for electronics: VTT Research programme 2000 - 2002 (pp. 27-38). VTT Technical Research Centre of Finland. VTT Symposium, No. 223 http://www.vtt.fi/inf/pdf/symposiums/2002/s223.pdf