Thermal management of fully LTCC-packaged Cs vapour cell for MEMS atomic clock

R.K. Chutani (Corresponding Author), S. Galliou, N. Passilly, C. Gorecki, Aila Sitomaniemi, Mikko Heikkinen, Kari Kautio, Antti Keränen, A. Jornod

    Research output: Contribution to journalArticleScientificpeer-review

    16 Citations (Scopus)


    This paper describes a study of the thermal behaviour of fully packaged Caesium vapour cell developed in the framework of the European collaborative research project called “MEMS atomic clocks for timing, frequency control and communications (MAC-TFC)”. This cell, along with various electronic and optical components, is embedded in a Low Temperature Co-fired Ceramics (LTCC) structure, in order to build a compact MEMS-based atomic clock. Functioning of such atomic clock depends on inner and outer environment of the Cs vapour cell, including parameters such as pressure and temperature of buffer gas. This paper is then devoted to study the thermal behaviour of a fully LTCC-packaged Cs vapour cell according to the ambient temperature change when it is locally temperature controlled. Simulations have been carried out by using analytical modelling and finite element based softwares. Different solutions concerning the LTCC structure such as bridges/suspensions, vacuum environment, metallic coating, as well as the optimal positions of the temperature-control elements have been investigated. Finally, preliminary experiments based on a prototype resulting from this study are presented and an additional solution based on the dynamic adjustment of the set temperature as a function of the ambient temperature is proposed.
    Original languageEnglish
    Pages (from-to)58-68
    JournalSensors and Actuators A: Physical
    Publication statusPublished - 2012
    MoE publication typeA1 Journal article-refereed


    This work is supported by a collaborative project MAC-TFC of the European Commission (FP 7, ICT program, grant no. 224132)


    • Finite element method
    • LTCC packaging
    • MEMS atomic clock
    • steady state analysis
    • thermal behaviour


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