Thermal management of power MMIC on LTCC substrate

Tuomo Jaakola, Kari Kautio, Jarno Petäjä, Jaakko Lenkkeri

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publication14th European Microelectronics and Packaging Conference & Exhibition
    PublisherIMAPS Nordic
    Pages86-91
    Publication statusPublished - 2003
    MoE publication typeNot Eligible
    Event14th European Microelectronics and Packaging Conference, EPMC 2003 - Friedrichshafen, Germany
    Duration: 23 Jun 200325 Jun 2003

    Conference

    Conference14th European Microelectronics and Packaging Conference, EPMC 2003
    CountryGermany
    CityFriedrichshafen
    Period23/06/0325/06/03

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