Thermal management of power MMIC on LTCC substrate

Tuomo Jaakola, Kari Kautio, Jarno Petäjä, Jaakko Lenkkeri

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publication14th European Microelectronics and Packaging Conference & Exhibition
PublisherIMAPS Nordic
Pages86-91
Publication statusPublished - 2003
MoE publication typeNot Eligible
Event14th European Microelectronics and Packaging Conference, EPMC 2003 - Friedrichshafen, Germany
Duration: 23 Jun 200325 Jun 2003

Conference

Conference14th European Microelectronics and Packaging Conference, EPMC 2003
CountryGermany
CityFriedrichshafen
Period23/06/0325/06/03

Cite this