Thermal management of power MMIC on LTCC substrate

Tuomo Jaakola; Kari Kautio; Jarno Petäjä; Jaakko Lenkkeri

Thermal management of power MMIC on LTCC substrate

Tuomo Jaakola, Kari Kautio, Jarno Petäjä, Jaakko Lenkkeri

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	14th European Microelectronics and Packaging Conference & Exhibition
Publisher	IMAPS Nordic
Pages	86-91
Publication status	Published - 2003
MoE publication type	Not Eligible
Event	14th European Microelectronics and Packaging Conference, EPMC 2003 - Friedrichshafen, Germany Duration: 23 Jun 2003 → 25 Jun 2003

Conference

Conference	14th European Microelectronics and Packaging Conference, EPMC 2003
Country/Territory	Germany
City	Friedrichshafen
Period	23/06/03 → 25/06/03

Cite this

@inproceedings{bc49c165154a4db4a853ca2d5674778f,

title = "Thermal management of power MMIC on LTCC substrate",

author = "Tuomo Jaakola and Kari Kautio and Jarno Pet{\"a}j{\"a} and Jaakko Lenkkeri",

note = "CD-ROM proceedings, no ISBN/ISSN found; 14th European Microelectronics and Packaging Conference, EPMC 2003 ; Conference date: 23-06-2003 Through 25-06-2003",

year = "2003",

language = "English",

pages = "86--91",

booktitle = "14th European Microelectronics and Packaging Conference & Exhibition",

publisher = "IMAPS Nordic",

address = "Finland",

}

TY - GEN

T1 - Thermal management of power MMIC on LTCC substrate

AU - Jaakola, Tuomo

AU - Kautio, Kari

AU - Petäjä, Jarno

AU - Lenkkeri, Jaakko

N1 - CD-ROM proceedings, no ISBN/ISSN found

PY - 2003

Y1 - 2003

M3 - Conference article in proceedings

SP - 86

EP - 91

BT - 14th European Microelectronics and Packaging Conference & Exhibition

PB - IMAPS Nordic

T2 - 14th European Microelectronics and Packaging Conference, EPMC 2003

Y2 - 23 June 2003 through 25 June 2003

ER -