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Thermal Performance Comparison
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High-power Diode
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83%
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Thermal via
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Bowing
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light emitting diodes
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Engineering
Thermal Performance
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Light-Emitting Diode
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Aluminum Substrate
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Material System
50%
System Technology
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Printed Circuit Board
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Heat Resistance
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Coefficient of Thermal Expansion
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Module Design
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Insulation System
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Current Drive
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Exponential Growth
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Material Science
Light-Emitting Diode
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Electronic Circuit
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Heat Resistance
16%
Thermal Expansion
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Chemical Engineering
Polychlorinated Biphenyl
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Film
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