Thermal resistance in superconducting flip-chip assemblies

J. Hätinen* (Corresponding Author), E. Mykkänen, K. Viisanen, A. Ronzani, A. Kemppinen, L. Lehtisyrjä, J. S. Lehtinen, M. Prunnila

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

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Engineering

Physics

Material Science

Chemical Engineering