Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration

S. Autti; F. C. Bettsworth; Kestutis Grigoras; D. Gunnarsson; R. P. Haley; A. T. Jones; Yu A. Pashkin; J. R. Prance; Mika Prunnila; M. D. Thompson; D. E. Zmeev

doi:10.1103/PhysRevLett.131.077001

Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration

S. Autti^*
, F. C. Bettsworth
, Kestutis Grigoras
, D. Gunnarsson
, R. P. Haley
, A. T. Jones
, Yu A. Pashkin
, J. R. Prance
, Mika Prunnila
, M. D. Thompson
, D. E. Zmeev

^*Corresponding author for this work

Lancaster University

Research output: Contribution to journal › Article › Scientific › peer-review

6 Citations (Scopus)

Abstract

On-chip demagnetization refrigeration has recently emerged as a powerful tool for reaching microkelvin electron temperatures in nanoscale structures. The relative importance of cooling on-chip and off-chip components and the thermal subsystem dynamics are yet to be analyzed. We study a Coulomb blockade thermometer with on-chip copper refrigerant both experimentally and numerically, showing that dynamics in this device are captured by a first-principles model. Our work shows how to simulate thermal dynamics in devices down to microkelvin temperatures, and outlines a recipe for a low-investment platform for quantum technologies and fundamental nanoscience in this novel temperature range.

Original language	English
Article number	077001
Journal	Physical Review Letters
Volume	131
Issue number	7
DOIs	https://doi.org/10.1103/PhysRevLett.131.077001
Publication status	Published - 18 Aug 2023
MoE publication type	A1 Journal article-refereed

Funding

The simulation codes can be obtained from the corresponding author upon reasonable request. This research is supported by the U.K. EPSRC (No. EP/K01675X/1, No. EP/N019199/1, No. EP/P024203/1, No. EP/L000016/1, and No. EP/W015730/1), the European FP7 Programme MICROKELVIN (No. 228464), the European Union’s Horizon 2020 research and innovation programme (European Microkelvin Platform 824109, and EFINED 766853), by the Academy of Finland through the Centre of Excellence program (Projects No. 336817 and No. 312294), and by Business Finland through QuTI-project (No. 40562/31/2020). S. A. acknowledges financial support from the Jenny and Antti Wihuri Foundation via the Council of Finnish Foundations. M. D. T acknowledges financial support from the Royal Academy of Engineering (No. RF/201819/18/2). Yu. A. P. acknowledges support from the QSHS project ST/T006102/1 funded by STFC.

Access to Document

10.1103/PhysRevLett.131.077001Licence: CC BY

Cite this

@article{70315b97a19848acb0c0ea8b0b76e1f4,

title = "Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration",

abstract = "On-chip demagnetization refrigeration has recently emerged as a powerful tool for reaching microkelvin electron temperatures in nanoscale structures. The relative importance of cooling on-chip and off-chip components and the thermal subsystem dynamics are yet to be analyzed. We study a Coulomb blockade thermometer with on-chip copper refrigerant both experimentally and numerically, showing that dynamics in this device are captured by a first-principles model. Our work shows how to simulate thermal dynamics in devices down to microkelvin temperatures, and outlines a recipe for a low-investment platform for quantum technologies and fundamental nanoscience in this novel temperature range.",

author = "S. Autti and Bettsworth, \{F. C.\} and Kestutis Grigoras and D. Gunnarsson and Haley, \{R. P.\} and Jones, \{A. T.\} and Pashkin, \{Yu A.\} and Prance, \{J. R.\} and Mika Prunnila and Thompson, \{M. D.\} and Zmeev, \{D. E.\}",

note = "Funding Information: The simulation codes can be obtained from the corresponding author upon reasonable request. This research is supported by the U.K. EPSRC (No. EP/K01675X/1, No. EP/N019199/1, No. EP/P024203/1, No. EP/L000016/1, and No. EP/W015730/1), the European FP7 Programme MICROKELVIN (No. 228464), the European Union{\textquoteright}s Horizon 2020 research and innovation programme (European Microkelvin Platform 824109, and EFINED 766853), by the Academy of Finland through the Centre of Excellence program (Projects No. 336817 and No. 312294), and by Business Finland through QuTI-project (No. 40562/31/2020). S. A. acknowledges financial support from the Jenny and Antti Wihuri Foundation via the Council of Finnish Foundations. M. D. T acknowledges financial support from the Royal Academy of Engineering (No. RF/201819/18/2). Yu. A. P. acknowledges support from the QSHS project ST/T006102/1 funded by STFC. ",

year = "2023",

month = aug,

day = "18",

doi = "10.1103/PhysRevLett.131.077001",

language = "English",

volume = "131",

journal = "Physical Review Letters",

issn = "0031-9007",

publisher = "American Physical Society (APS)",

number = "7",

}

TY - JOUR

T1 - Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration

AU - Autti, S.

AU - Bettsworth, F. C.

AU - Grigoras, Kestutis

AU - Gunnarsson, D.

AU - Haley, R. P.

AU - Jones, A. T.

AU - Pashkin, Yu A.

AU - Prance, J. R.

AU - Prunnila, Mika

AU - Thompson, M. D.

AU - Zmeev, D. E.

N1 - Funding Information: The simulation codes can be obtained from the corresponding author upon reasonable request. This research is supported by the U.K. EPSRC (No. EP/K01675X/1, No. EP/N019199/1, No. EP/P024203/1, No. EP/L000016/1, and No. EP/W015730/1), the European FP7 Programme MICROKELVIN (No. 228464), the European Union’s Horizon 2020 research and innovation programme (European Microkelvin Platform 824109, and EFINED 766853), by the Academy of Finland through the Centre of Excellence program (Projects No. 336817 and No. 312294), and by Business Finland through QuTI-project (No. 40562/31/2020). S. A. acknowledges financial support from the Jenny and Antti Wihuri Foundation via the Council of Finnish Foundations. M. D. T acknowledges financial support from the Royal Academy of Engineering (No. RF/201819/18/2). Yu. A. P. acknowledges support from the QSHS project ST/T006102/1 funded by STFC.

PY - 2023/8/18

Y1 - 2023/8/18

N2 - On-chip demagnetization refrigeration has recently emerged as a powerful tool for reaching microkelvin electron temperatures in nanoscale structures. The relative importance of cooling on-chip and off-chip components and the thermal subsystem dynamics are yet to be analyzed. We study a Coulomb blockade thermometer with on-chip copper refrigerant both experimentally and numerically, showing that dynamics in this device are captured by a first-principles model. Our work shows how to simulate thermal dynamics in devices down to microkelvin temperatures, and outlines a recipe for a low-investment platform for quantum technologies and fundamental nanoscience in this novel temperature range.

AB - On-chip demagnetization refrigeration has recently emerged as a powerful tool for reaching microkelvin electron temperatures in nanoscale structures. The relative importance of cooling on-chip and off-chip components and the thermal subsystem dynamics are yet to be analyzed. We study a Coulomb blockade thermometer with on-chip copper refrigerant both experimentally and numerically, showing that dynamics in this device are captured by a first-principles model. Our work shows how to simulate thermal dynamics in devices down to microkelvin temperatures, and outlines a recipe for a low-investment platform for quantum technologies and fundamental nanoscience in this novel temperature range.

UR - https://www.scopus.com/pages/publications/85168601322

U2 - 10.1103/PhysRevLett.131.077001

DO - 10.1103/PhysRevLett.131.077001

M3 - Article

AN - SCOPUS:85168601322

SN - 0031-9007

VL - 131

JO - Physical Review Letters

JF - Physical Review Letters

IS - 7

M1 - 077001

ER -

Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration

Abstract

Funding

Access to Document

Other files and links

Fingerprint

OtaNano

Cite this

Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration

Abstract

Funding

Access to Document

Other files and links

Fingerprint

Equipment

OtaNano

Cite this