Abstract
In the context of the ATHENA X-IFU Cryogenic AntiCoincidence detector (CryoAC) development, we have studied the thermalization properties of a 2 × 2 mm SQUID chip. The chip is glued on a front-end PCB and operated on the cold stage of a dilution refrigerator (T BASE < 20 mK). We performed thermal conductance measurements by using different materials to glue the SQUID chip on the PCB. These have been repeated in subsequent cryostat runs, to highlight degradation effects due to thermal cycles. Here, we present the results obtained by glues and greases widely used in cryogenic environments, i.e., GE 7031 Varnish Glue, Apiezon N Grease and Rubber Cement.
| Original language | English |
|---|---|
| Pages (from-to) | 190-199 |
| Journal | Journal of Low Temperature Physics |
| Volume | 214 |
| Issue number | 3-4 |
| DOIs | |
| Publication status | Published - Feb 2024 |
| MoE publication type | A1 Journal article-refereed |
Funding
Open access funding provided by Istituto Nazionale di Astrofisica within the CRUI-CARE Agreement. This work has been supported by ASI (Italian Space Agency) contract n. 2019-27-HH.0. The authors would like to thank Jan van der Kuur (SRON) for useful discussion. M.D. thanks Ciclofisica (the Ciclofficina «Roberto Perciballi») for the Rubber Cement supply.
Keywords
- ATHENA
- CryoAC
- Cryogenic glues
- SQUID thermalization
- Thermal conductance