Thermo-mechanical simulations of LTCC packages for RF MEMS applications

Jaakko Lenkkeri, Eveliina Juntunen, Markku Lahti, S. Bouwstra

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

Stresses and strains in assemblies of a silicon-based MEMS chip and in an LTCC package have been simulated using Comsol Multiphysics simulation software. The simulated structures included the MEMS chip either wire bonded or flip-chip bonded into a cavity in a LTCC substrate and an LTCC lid sealed on top of the cavity. For die bonding of the MEMS chip and for sealing of the lid AuSn solder material was assumed and for the flip-chip joining of the MEMS chip Au-bumps and thermo compression bonding process were assumed. Both 2D and 3D simulations were made for a temperature range between 218 K and 393 K, for pressures up to 100 bar, for shear force applied either to chip or lid edge and for heat dissipation of 1 W applied to the chip. The effects of 2nd level packaging were also studied. The simulations show that the strains at the surface of the MEMS components are larger in the flip-chip type chip compared with wire bonded chip. For thermal management of the LTCC type package thermal vias through the LTCC substrate will be necessary. Several possible ways for minimizing the strains in the MEMS component are discussed in this article. (4 refs.)
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publication11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Place of PublicationPiscataway, NJ, USA
PublisherInstitute of Electrical and Electronic Engineers IEEE
Number of pages6
ISBN (Electronic)978-1-4244-7027-3
ISBN (Print)978-1-4244-7026-6
DOIs
Publication statusPublished - 2010
MoE publication typeA4 Article in a conference publication
Event11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 - Bordeaux, France
Duration: 26 Apr 201028 Apr 2010

Conference

Conference11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Abbreviated titleEuroSimE 2010
CountryFrance
CityBordeaux
Period26/04/1028/04/10

Fingerprint

MEMS
Wire
Substrates
Heat losses
Temperature control
Joining
Soldering alloys
Packaging
Silicon
Temperature

Cite this

Lenkkeri, J., Juntunen, E., Lahti, M., & Bouwstra, S. (2010). Thermo-mechanical simulations of LTCC packages for RF MEMS applications. In Proceedings: 11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010 Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/ESIME.2010.5464591
Lenkkeri, Jaakko ; Juntunen, Eveliina ; Lahti, Markku ; Bouwstra, S. / Thermo-mechanical simulations of LTCC packages for RF MEMS applications. Proceedings: 11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010. Piscataway, NJ, USA : Institute of Electrical and Electronic Engineers IEEE, 2010.
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Lenkkeri, J, Juntunen, E, Lahti, M & Bouwstra, S 2010, Thermo-mechanical simulations of LTCC packages for RF MEMS applications. in Proceedings: 11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010. Institute of Electrical and Electronic Engineers IEEE, Piscataway, NJ, USA, 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, Bordeaux, France, 26/04/10. https://doi.org/10.1109/ESIME.2010.5464591

Thermo-mechanical simulations of LTCC packages for RF MEMS applications. / Lenkkeri, Jaakko; Juntunen, Eveliina; Lahti, Markku; Bouwstra, S.

Proceedings: 11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010. Piscataway, NJ, USA : Institute of Electrical and Electronic Engineers IEEE, 2010.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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N2 - Stresses and strains in assemblies of a silicon-based MEMS chip and in an LTCC package have been simulated using Comsol Multiphysics simulation software. The simulated structures included the MEMS chip either wire bonded or flip-chip bonded into a cavity in a LTCC substrate and an LTCC lid sealed on top of the cavity. For die bonding of the MEMS chip and for sealing of the lid AuSn solder material was assumed and for the flip-chip joining of the MEMS chip Au-bumps and thermo compression bonding process were assumed. Both 2D and 3D simulations were made for a temperature range between 218 K and 393 K, for pressures up to 100 bar, for shear force applied either to chip or lid edge and for heat dissipation of 1 W applied to the chip. The effects of 2nd level packaging were also studied. The simulations show that the strains at the surface of the MEMS components are larger in the flip-chip type chip compared with wire bonded chip. For thermal management of the LTCC type package thermal vias through the LTCC substrate will be necessary. Several possible ways for minimizing the strains in the MEMS component are discussed in this article. (4 refs.)

AB - Stresses and strains in assemblies of a silicon-based MEMS chip and in an LTCC package have been simulated using Comsol Multiphysics simulation software. The simulated structures included the MEMS chip either wire bonded or flip-chip bonded into a cavity in a LTCC substrate and an LTCC lid sealed on top of the cavity. For die bonding of the MEMS chip and for sealing of the lid AuSn solder material was assumed and for the flip-chip joining of the MEMS chip Au-bumps and thermo compression bonding process were assumed. Both 2D and 3D simulations were made for a temperature range between 218 K and 393 K, for pressures up to 100 bar, for shear force applied either to chip or lid edge and for heat dissipation of 1 W applied to the chip. The effects of 2nd level packaging were also studied. The simulations show that the strains at the surface of the MEMS components are larger in the flip-chip type chip compared with wire bonded chip. For thermal management of the LTCC type package thermal vias through the LTCC substrate will be necessary. Several possible ways for minimizing the strains in the MEMS component are discussed in this article. (4 refs.)

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Lenkkeri J, Juntunen E, Lahti M, Bouwstra S. Thermo-mechanical simulations of LTCC packages for RF MEMS applications. In Proceedings: 11th International. Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2010. Piscataway, NJ, USA: Institute of Electrical and Electronic Engineers IEEE. 2010 https://doi.org/10.1109/ESIME.2010.5464591