@inproceedings{7dc31a2efbb540deb11bed8f9d54cce2,
title = "Thick-SOI Echelle grating for any-to-any wavelength routing interconnection in multi-socket computing environments",
abstract = "As data centers constantly expand, electronic switches are facing the challenge of enhanced scalability and the request for increased pin-count and bandwidth. Photonic technology and wavelength division multiplexing have always been a strong alternative for efficient routing and their potential was already proven in the telecoms. CWDM transceivers have emerged in the board-to-board level interconnection, revealing the potential for wavelength-routing to be applied in the datacom and an AWGR-based approach has recently been proposed towards building an optical multi-socket interconnection to offer any-to-any connectivity with high aggregated throughput and reduced power consumption. Echelle gratings have long been recognized as the multiplexing block exhibiting smallest footprint and robustness in a wide number of applications compared to other alternatives such as the Arrayed Waveguide Grating. Such filtering devices can also perform in a similar way to cyclical AWGR and serve as mid-board routing platforms in multi-socket environments. In this communication, we present such a 3x3 Echelle grating integrated on thick SOI platform with aluminum-coated facets that is shown to perform successful wavelength-routing functionality at 10 Gb/s. The device exhibits a footprint of 60x270 µm2, while the static characterization showed a 3 dB on-chip loss for the best channel. The 3 dB-bandwidth of the channels was 4.5 nm and the free spectral range was 90 nm. The echelle was evaluated in a 2*2 wavelength routing topology, exhibiting a power penalty of below 0.4 dB at 10-9 BER for the C-band. Further experimental evaluations of the platform involve commercially available CWDM datacenter transceivers, towards emulating an optically-interconnected multi-socket environment traffic scenario.",
keywords = "cyclic wavelength routing, Echelle grating, mid-board routing platform, multi-socket interconnections, thick-SOI, OtaNano",
author = "G. Dabos and S. Pitris and C. Mitsolidou and T. Alexoudi and D. Fitsios and Matteo Cherchi and Mikko Harjanne and Timo Aalto and G.T. Kanellos and N. Pleros",
year = "2017",
month = jan,
day = "1",
doi = "10.1117/12.2250772",
language = "English",
isbn = "978-1-5106-0659-3",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Chen, {Ray T.} and Henning Schroder",
booktitle = "Optical Interconnects XVII",
address = "United States",
note = "Optical Interconnects XVII ; Conference date: 30-01-2017 Through 01-02-2017",
}