Bulk micromachining technology can be used to produce conducting through-wafer polysilicon interconnects, i.e., polysilicon via plugs. This paper presents the process fabrication steps of polysilicon via plugs with in-situ boron doped polysilicon material in order to develop fast one-step doping process, without additional diffusion. The via holes can be processed by high-aspect ratio silicon etching with inductively coupled plasma (ICP).
|Series||MRS Online Proceedings |
|Conference||2005 MRS Spring Meeting, Symposium J: Micro- and Nanosystems - Materials and Devices|
|Period||28/03/05 → 1/04/05|
- through-wafer interconnects
- bulk micromachining