Tolerance analysis in assembly of mechanics for electronics

Juhani Heilala, Otso Väätäinen, Timo Salmi, Paavo Voho

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific


    Assembly is more than putting parts together; it can be seen as a product and a process. In this article, the focus is on assembly modelling, product level dimensional variation analysis and automated assembly process tolerance analysis. Dimensioning philosophy and the choice of tolerances is a function of design, which affects not only the product 's function and performance but also its manufacture and assembly. Tolerances constrain affect ease and the sequence of assembly, determining the specifications of assembly technology such as jigs and fixtures, assembly machines, robots, and grippers. In robotic assembly, the different schemes for accomplishing a task may have different success rates depending on what mechanical accuracy or force levels are involved or how sensitive the technique is to small errors in how the parts were made. Parts, fixtures and other equipment vary in size and position. These variations can mean that the robot will assemble one set of parts perfectly, yet will create assembly error with another set. To ensure that parts are loaded and assembled reliably, without misfits, a tolerance study must be done. The authors shall review the importance of tolerance analysis in assembly, product and process development. Different tolerance analysis methods and types of tools exist and are shown in the paper. This is an introduction, a current state review of tolerance analysis and a feasibility study of potential method and software to be used in the tolerance analysis for the precise assembly of electromechanical products.
    Original languageEnglish
    Title of host publicationMechanics for electronics
    Subtitle of host publicationVTT Research programme 2000 - 2002
    Place of PublicationEspoo
    PublisherVTT Technical Research Centre of Finland
    ISBN (Electronic)951-38-5737-9
    ISBN (Print)951-38-5736-0
    Publication statusPublished - 2002
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventMechanics for Electronics
    : VTT Research Programme 2000–2002
    - Espoo, Finland
    Duration: 4 Dec 20024 Dec 2002

    Publication series

    SeriesVTT Symposium


    SeminarMechanics for Electronics


    • tolerance analysis methods
    • assembly modelling
    • assembly process and equipment design
    • digital plant technologies


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