Towards low cost coupling structures for short distance optical interconnections

Nina Hendrickx; Jurgen Van Erps; Teemu Alajoki; N.  Destouches; Daniele Blanc; Janyce Franc; Pentti Karioja; Hugo Thienpont; Peter Van Daele

Towards low cost coupling structures for short distance optical interconnections

Nina Hendrickx, Jurgen Van Erps, Teemu Alajoki, N. Destouches, Daniele Blanc, Janyce Franc, Pentti Karioja, Hugo Thienpont, Peter Van Daele

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Abstract

The performance of short distance optical interconnections in general relies very strongly on coupling structures, since they will determine the overall efficiency of the system to a large extent. Different configurations can be considered and a variety of manufacturing technologies can be used. We present two different discrete and two different integrated coupling components which can be used to deflect the light beam over 90° and can play a crucial role when integrating optical interconnections in printed circuit boards. The fabrication process of the different coupling structures is discussed and experimental results are shown. The main characteristics of the coupling structures are given. The main advantages and disadvantages of the different components are discussed.

Original language	English
Title of host publication	16th European Microelectronics and Packaging Conference and Exhibition
Subtitle of host publication	EMPC 2007
Publisher	Curran Associates Inc.
Pages	247-252
Number of pages	6
ISBN (Print)	978-1-62276-466-2
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007 Conference number: 16

Conference

Conference	16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated title	EMPC 2007
Country/Territory	Finland
City	Oulu
Period	17/06/07 → 20/06/07

Keywords

coupling structures
deep proton writing
diffraction grating
laser ablation
printed circuit board

Cite this

@inproceedings{65504b9699564280a77fca54338ec053,

title = "Towards low cost coupling structures for short distance optical interconnections",

abstract = "The performance of short distance optical interconnections in general relies very strongly on coupling structures, since they will determine the overall efficiency of the system to a large extent. Different configurations can be considered and a variety of manufacturing technologies can be used. We present two different discrete and two different integrated coupling components which can be used to deflect the light beam over 90° and can play a crucial role when integrating optical interconnections in printed circuit boards. The fabrication process of the different coupling structures is discussed and experimental results are shown. The main characteristics of the coupling structures are given. The main advantages and disadvantages of the different components are discussed. ",

keywords = "coupling structures, deep proton writing, diffraction grating, laser ablation, printed circuit board",

author = "Nina Hendrickx and {Van Erps}, Jurgen and Teemu Alajoki and N. Destouches and Daniele Blanc and Janyce Franc and Pentti Karioja and Hugo Thienpont and {Van Daele}, Peter",

year = "2007",

language = "English",

isbn = "978-1-62276-466-2",

pages = "247--252",

booktitle = "16th European Microelectronics and Packaging Conference and Exhibition",

publisher = "Curran Associates Inc.",

address = "United States",

note = "16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 ; Conference date: 17-06-2007 Through 20-06-2007",

}

Hendrickx, N, Van Erps, J, Alajoki, T, Destouches, N, Blanc, D, Franc, J, Karioja, P, Thienpont, H & Van Daele, P 2007, Towards low cost coupling structures for short distance optical interconnections. in 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. Curran Associates Inc., pp. 247-252, 16th European Microelectronics and Packaging Conference and Exhibition, Oulu, Finland, 17/06/07.

Towards low cost coupling structures for short distance optical interconnections. / Hendrickx, Nina; Van Erps, Jurgen; Alajoki, Teemu et al.
16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. Curran Associates Inc., 2007. p. 247-252.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Towards low cost coupling structures for short distance optical interconnections

AU - Hendrickx, Nina

AU - Van Erps, Jurgen

AU - Alajoki, Teemu

AU - Destouches, N.

AU - Blanc, Daniele

AU - Franc, Janyce

AU - Karioja, Pentti

AU - Thienpont, Hugo

AU - Van Daele, Peter

N1 - Conference code: 16

PY - 2007

Y1 - 2007

N2 - The performance of short distance optical interconnections in general relies very strongly on coupling structures, since they will determine the overall efficiency of the system to a large extent. Different configurations can be considered and a variety of manufacturing technologies can be used. We present two different discrete and two different integrated coupling components which can be used to deflect the light beam over 90° and can play a crucial role when integrating optical interconnections in printed circuit boards. The fabrication process of the different coupling structures is discussed and experimental results are shown. The main characteristics of the coupling structures are given. The main advantages and disadvantages of the different components are discussed.

AB - The performance of short distance optical interconnections in general relies very strongly on coupling structures, since they will determine the overall efficiency of the system to a large extent. Different configurations can be considered and a variety of manufacturing technologies can be used. We present two different discrete and two different integrated coupling components which can be used to deflect the light beam over 90° and can play a crucial role when integrating optical interconnections in printed circuit boards. The fabrication process of the different coupling structures is discussed and experimental results are shown. The main characteristics of the coupling structures are given. The main advantages and disadvantages of the different components are discussed.

KW - coupling structures

KW - deep proton writing

KW - diffraction grating

KW - laser ablation

KW - printed circuit board

M3 - Conference article in proceedings

SN - 978-1-62276-466-2

SP - 247

EP - 252

BT - 16th European Microelectronics and Packaging Conference and Exhibition

PB - Curran Associates Inc.

T2 - 16th European Microelectronics and Packaging Conference and Exhibition

Y2 - 17 June 2007 through 20 June 2007

ER -

Towards low cost coupling structures for short distance optical interconnections

Abstract

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Keywords

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