Towards low cost coupling structures for short distance optical interconnections

Nina Hendrickx, Jurgen Van Erps, Teemu Alajoki, N. Destouches, Daniele Blanc, Janyce Franc, Pentti Karioja, Hugo Thienpont, Peter Van Daele

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

3 Citations (Scopus)

Abstract

The performance of short distance optical interconnections in general relies very strongly on coupling structures, since they will determine the overall efficiency of the system to a large extent. Different configurations can be considered and a variety of manufacturing technologies can be used. We present two different discrete and two different integrated coupling components which can be used to deflect the light beam over 90° and can play a crucial role when integrating optical interconnections in printed circuit boards. The fabrication process of the different coupling structures is discussed and experimental results are shown. The main characteristics of the coupling structures are given. The main advantages and disadvantages of the different components are discussed.
Original languageEnglish
Title of host publication16th European Microelectronics and Packaging Conference and Exhibition
Subtitle of host publicationEMPC 2007
PublisherCurran Associates Inc.
Pages247-252
Number of pages6
ISBN (Print)978-1-62276-466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007
Conference number: 16

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated titleEMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Fingerprint

printed circuits
circuit boards
light beams
manufacturing
fabrication
configurations

Keywords

  • coupling structures
  • deep proton writing
  • diffraction grating
  • laser ablation
  • printed circuit board

Cite this

Hendrickx, N., Van Erps, J., Alajoki, T., Destouches, N., Blanc, D., Franc, J., ... Van Daele, P. (2007). Towards low cost coupling structures for short distance optical interconnections. In 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007 (pp. 247-252). Curran Associates Inc..
Hendrickx, Nina ; Van Erps, Jurgen ; Alajoki, Teemu ; Destouches, N. ; Blanc, Daniele ; Franc, Janyce ; Karioja, Pentti ; Thienpont, Hugo ; Van Daele, Peter. / Towards low cost coupling structures for short distance optical interconnections. 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. Curran Associates Inc., 2007. pp. 247-252
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title = "Towards low cost coupling structures for short distance optical interconnections",
abstract = "The performance of short distance optical interconnections in general relies very strongly on coupling structures, since they will determine the overall efficiency of the system to a large extent. Different configurations can be considered and a variety of manufacturing technologies can be used. We present two different discrete and two different integrated coupling components which can be used to deflect the light beam over 90° and can play a crucial role when integrating optical interconnections in printed circuit boards. The fabrication process of the different coupling structures is discussed and experimental results are shown. The main characteristics of the coupling structures are given. The main advantages and disadvantages of the different components are discussed.",
keywords = "coupling structures, deep proton writing, diffraction grating, laser ablation, printed circuit board",
author = "Nina Hendrickx and {Van Erps}, Jurgen and Teemu Alajoki and N. Destouches and Daniele Blanc and Janyce Franc and Pentti Karioja and Hugo Thienpont and {Van Daele}, Peter",
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Hendrickx, N, Van Erps, J, Alajoki, T, Destouches, N, Blanc, D, Franc, J, Karioja, P, Thienpont, H & Van Daele, P 2007, Towards low cost coupling structures for short distance optical interconnections. in 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. Curran Associates Inc., pp. 247-252, 16th European Microelectronics and Packaging Conference and Exhibition, Oulu, Finland, 17/06/07.

Towards low cost coupling structures for short distance optical interconnections. / Hendrickx, Nina; Van Erps, Jurgen; Alajoki, Teemu; Destouches, N. ; Blanc, Daniele; Franc, Janyce; Karioja, Pentti; Thienpont, Hugo; Van Daele, Peter.

16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. Curran Associates Inc., 2007. p. 247-252.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Hendrickx, Nina

AU - Van Erps, Jurgen

AU - Alajoki, Teemu

AU - Destouches, N.

AU - Blanc, Daniele

AU - Franc, Janyce

AU - Karioja, Pentti

AU - Thienpont, Hugo

AU - Van Daele, Peter

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AB - The performance of short distance optical interconnections in general relies very strongly on coupling structures, since they will determine the overall efficiency of the system to a large extent. Different configurations can be considered and a variety of manufacturing technologies can be used. We present two different discrete and two different integrated coupling components which can be used to deflect the light beam over 90° and can play a crucial role when integrating optical interconnections in printed circuit boards. The fabrication process of the different coupling structures is discussed and experimental results are shown. The main characteristics of the coupling structures are given. The main advantages and disadvantages of the different components are discussed.

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KW - deep proton writing

KW - diffraction grating

KW - laser ablation

KW - printed circuit board

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Hendrickx N, Van Erps J, Alajoki T, Destouches N, Blanc D, Franc J et al. Towards low cost coupling structures for short distance optical interconnections. In 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. Curran Associates Inc. 2007. p. 247-252