Projects per year
Abstract
The unique properties of two-dimensional (2D) materials bring great promise to improve sensor performance and realise novel sensing principles. However, to enable their high-volume production, wafer-scale processes that allow integration with electronic readout circuits need to be developed. In this perspective, we review recent progress in on-chip 2D material sensors, and compare their performance to the state-of-the-art, with a focus on results achieved in the Graphene Flagship programme. We discuss transfer-based and transfer-free production flows and routes for complementary metal-oxide-semiconductor integration and prototype development. Finally, we give an outlook on the future of 2D material sensors, and sketch a roadmap towards realising their industrial and societal impact.
Original language | English |
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Article number | 023002 |
Journal | 2D Materials |
Volume | 12 |
Issue number | 2 |
DOIs | |
Publication status | Published - 1 Apr 2025 |
MoE publication type | A1 Journal article-refereed |
Funding
This work has received funding from European Union's Horizon 2020 research and innovation programme under Grant Agreement 881603 (Graphene Flagship Core 3). The ICN2 is funded by the CERCA programme/Generalitat de Catalunya. The ICN2 is supported by the Severo Ochoa Centres of Excellence programme, Grant CEX2021-001214-S, funded by MCIN/AEI/10.13039.501100011033.
Keywords
- 2D materials
- CMOS
- graphene
- MEMS
- NEMS
- sensor
- waferscale
Fingerprint
Dive into the research topics of 'Towards wafer-scale 2D material sensors'. Together they form a unique fingerprint.Projects
- 1 Finished
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GrapheneCore3: Graphene Flagship Core Project 3
Sandberg, H. (Manager), Arpiainen, S. (PI), Smolander, M. (Participant), Soikkeli, M. (Participant) & Ruotsalainen, T. (Participant)
1/04/20 → 30/09/23
Project: EU project