Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

Timo Aalto, Mikko Harjanne, Tapani Vehmas, Mikko Karppinen, Aila Sitomaniemi, Antonio Malacarne, Christian Neumeyr, Johan Bauwelinck

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

    Original languageEnglish
    Title of host publication43rd European Conference on Optical Communication, ECOC 2017
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1-3
    Number of pages3
    Volume2017-September
    ISBN (Electronic)978-1-5386-5624-2
    DOIs
    Publication statusPublished - 24 Apr 2018
    MoE publication typeA4 Article in a conference publication
    Event43rd European Conference on Optical Communication, ECOC 2017 - Gothenburg, Sweden
    Duration: 17 Sep 201721 Sep 2017

    Conference

    Conference43rd European Conference on Optical Communication, ECOC 2017
    CountrySweden
    CityGothenburg
    Period17/09/1721/09/17

    Fingerprint

    Silicon
    Transceivers
    Surface emitting lasers
    Photodiodes
    Modulators
    Waveguides
    Networks (circuits)

    Cite this

    Aalto, T., Harjanne, M., Vehmas, T., Karppinen, M., Sitomaniemi, A., Malacarne, A., ... Bauwelinck, J. (2018). Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. In 43rd European Conference on Optical Communication, ECOC 2017 (Vol. 2017-September, pp. 1-3). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ECOC.2017.8345865
    Aalto, Timo ; Harjanne, Mikko ; Vehmas, Tapani ; Karppinen, Mikko ; Sitomaniemi, Aila ; Malacarne, Antonio ; Neumeyr, Christian ; Bauwelinck, Johan. / Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September IEEE Institute of Electrical and Electronic Engineers , 2018. pp. 1-3
    @inproceedings{160d7207879f4e99925a0871138da2cc,
    title = "Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips",
    abstract = "We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.",
    author = "Timo Aalto and Mikko Harjanne and Tapani Vehmas and Mikko Karppinen and Aila Sitomaniemi and Antonio Malacarne and Christian Neumeyr and Johan Bauwelinck",
    year = "2018",
    month = "4",
    day = "24",
    doi = "10.1109/ECOC.2017.8345865",
    language = "English",
    volume = "2017-September",
    pages = "1--3",
    booktitle = "43rd European Conference on Optical Communication, ECOC 2017",
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    Aalto, T, Harjanne, M, Vehmas, T, Karppinen, M, Sitomaniemi, A, Malacarne, A, Neumeyr, C & Bauwelinck, J 2018, Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. in 43rd European Conference on Optical Communication, ECOC 2017. vol. 2017-September, IEEE Institute of Electrical and Electronic Engineers , pp. 1-3, 43rd European Conference on Optical Communication, ECOC 2017, Gothenburg, Sweden, 17/09/17. https://doi.org/10.1109/ECOC.2017.8345865

    Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. / Aalto, Timo; Harjanne, Mikko; Vehmas, Tapani; Karppinen, Mikko; Sitomaniemi, Aila; Malacarne, Antonio; Neumeyr, Christian; Bauwelinck, Johan.

    43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September IEEE Institute of Electrical and Electronic Engineers , 2018. p. 1-3.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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    T1 - Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

    AU - Aalto, Timo

    AU - Harjanne, Mikko

    AU - Vehmas, Tapani

    AU - Karppinen, Mikko

    AU - Sitomaniemi, Aila

    AU - Malacarne, Antonio

    AU - Neumeyr, Christian

    AU - Bauwelinck, Johan

    PY - 2018/4/24

    Y1 - 2018/4/24

    N2 - We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

    AB - We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

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    BT - 43rd European Conference on Optical Communication, ECOC 2017

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    Aalto T, Harjanne M, Vehmas T, Karppinen M, Sitomaniemi A, Malacarne A et al. Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. In 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September. IEEE Institute of Electrical and Electronic Engineers . 2018. p. 1-3 https://doi.org/10.1109/ECOC.2017.8345865