Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

Timo Aalto; Mikko Harjanne; Tapani Vehmas; Mikko Karppinen; Aila Sitomaniemi; Antonio Malacarne; Christian Neumeyr; Johan Bauwelinck

doi:10.1109/ECOC.2017.8345865

Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

Timo Aalto, Mikko Harjanne, Tapani Vehmas, Mikko Karppinen, Aila Sitomaniemi, Antonio Malacarne, Christian Neumeyr, Johan Bauwelinck

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

2 Citations (Scopus)

Abstract

We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

Original language	English
Title of host publication	43rd European Conference on Optical Communication, ECOC 2017
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	1-3
Number of pages	3
Volume	2017-September
ISBN (Electronic)	978-1-5386-5624-2
DOIs	https://doi.org/10.1109/ECOC.2017.8345865
Publication status	Published - 24 Apr 2018
MoE publication type	A4 Article in a conference publication
Event	43rd European Conference on Optical Communication, ECOC 2017 - Gothenburg, Sweden Duration: 17 Sep 2017 → 21 Sep 2017

Conference

Conference	43rd European Conference on Optical Communication, ECOC 2017
Country	Sweden
City	Gothenburg
Period	17/09/17 → 21/09/17

Keywords

OtaNano

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Aalto, T., Harjanne, M., Vehmas, T., Karppinen, M., Sitomaniemi, A., Malacarne, A., Neumeyr, C., & Bauwelinck, J. (2018). Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. In 43rd European Conference on Optical Communication, ECOC 2017 (Vol. 2017-September, pp. 1-3). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ECOC.2017.8345865

Aalto, Timo ; Harjanne, Mikko ; Vehmas, Tapani ; Karppinen, Mikko ; Sitomaniemi, Aila ; Malacarne, Antonio ; Neumeyr, Christian ; Bauwelinck, Johan. / Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September IEEE Institute of Electrical and Electronic Engineers, 2018. pp. 1-3

@inproceedings{160d7207879f4e99925a0871138da2cc,

title = "Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips",

abstract = "We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.",

keywords = "OtaNano",

author = "Timo Aalto and Mikko Harjanne and Tapani Vehmas and Mikko Karppinen and Aila Sitomaniemi and Antonio Malacarne and Christian Neumeyr and Johan Bauwelinck",

year = "2018",

month = apr,

day = "24",

doi = "10.1109/ECOC.2017.8345865",

language = "English",

volume = "2017-September",

pages = "1--3",

booktitle = "43rd European Conference on Optical Communication, ECOC 2017",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "43rd European Conference on Optical Communication, ECOC 2017 ; Conference date: 17-09-2017 Through 21-09-2017",

}

Aalto, T , Harjanne, M , Vehmas, T , Karppinen, M , Sitomaniemi, A, Malacarne, A, Neumeyr, C & Bauwelinck, J 2018, Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. in 43rd European Conference on Optical Communication, ECOC 2017. vol. 2017-September, IEEE Institute of Electrical and Electronic Engineers, pp. 1-3, 43rd European Conference on Optical Communication, ECOC 2017, Gothenburg, Sweden, 17/09/17. https://doi.org/10.1109/ECOC.2017.8345865

Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. / Aalto, Timo ; Harjanne, Mikko ; Vehmas, Tapani ; Karppinen, Mikko ; Sitomaniemi, Aila; Malacarne, Antonio; Neumeyr, Christian; Bauwelinck, Johan.

43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September IEEE Institute of Electrical and Electronic Engineers, 2018. p. 1-3.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Vehmas, Tapani

AU - Karppinen, Mikko

AU - Sitomaniemi, Aila

AU - Malacarne, Antonio

AU - Neumeyr, Christian

AU - Bauwelinck, Johan

PY - 2018/4/24

Y1 - 2018/4/24

N2 - We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

AB - We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

KW - OtaNano

UR - http://www.scopus.com/inward/record.url?scp=85044339982&partnerID=8YFLogxK

U2 - 10.1109/ECOC.2017.8345865

DO - 10.1109/ECOC.2017.8345865

M3 - Conference article in proceedings

AN - SCOPUS:85044339982

VL - 2017-September

SP - 1

EP - 3

BT - 43rd European Conference on Optical Communication, ECOC 2017

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 43rd European Conference on Optical Communication, ECOC 2017

Y2 - 17 September 2017 through 21 September 2017

ER -

Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

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