Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

Timo Aalto, Mikko Harjanne, Tapani Vehmas, Mikko Karppinen, Aila Sitomaniemi, Antonio Malacarne, Christian Neumeyr, Johan Bauwelinck

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

Original languageEnglish
Title of host publication43rd European Conference on Optical Communication, ECOC 2017
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1-3
Number of pages3
Volume2017-September
ISBN (Electronic)978-1-5386-5624-2
DOIs
Publication statusPublished - 24 Apr 2018
MoE publication typeA4 Article in a conference publication
Event43rd European Conference on Optical Communication, ECOC 2017 - Gothenburg, Sweden
Duration: 17 Sep 201721 Sep 2017

Conference

Conference43rd European Conference on Optical Communication, ECOC 2017
CountrySweden
CityGothenburg
Period17/09/1721/09/17

Fingerprint

Silicon
Transceivers
Surface emitting lasers
Photodiodes
Modulators
Waveguides
Networks (circuits)

Cite this

Aalto, T., Harjanne, M., Vehmas, T., Karppinen, M., Sitomaniemi, A., Malacarne, A., ... Bauwelinck, J. (2018). Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. In 43rd European Conference on Optical Communication, ECOC 2017 (Vol. 2017-September, pp. 1-3). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ECOC.2017.8345865
Aalto, Timo ; Harjanne, Mikko ; Vehmas, Tapani ; Karppinen, Mikko ; Sitomaniemi, Aila ; Malacarne, Antonio ; Neumeyr, Christian ; Bauwelinck, Johan. / Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September IEEE Institute of Electrical and Electronic Engineers , 2018. pp. 1-3
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abstract = "We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.",
author = "Timo Aalto and Mikko Harjanne and Tapani Vehmas and Mikko Karppinen and Aila Sitomaniemi and Antonio Malacarne and Christian Neumeyr and Johan Bauwelinck",
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Aalto, T, Harjanne, M, Vehmas, T, Karppinen, M, Sitomaniemi, A, Malacarne, A, Neumeyr, C & Bauwelinck, J 2018, Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. in 43rd European Conference on Optical Communication, ECOC 2017. vol. 2017-September, IEEE Institute of Electrical and Electronic Engineers , pp. 1-3, 43rd European Conference on Optical Communication, ECOC 2017, Gothenburg, Sweden, 17/09/17. https://doi.org/10.1109/ECOC.2017.8345865

Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. / Aalto, Timo; Harjanne, Mikko; Vehmas, Tapani; Karppinen, Mikko; Sitomaniemi, Aila; Malacarne, Antonio; Neumeyr, Christian; Bauwelinck, Johan.

43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September IEEE Institute of Electrical and Electronic Engineers , 2018. p. 1-3.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Neumeyr, Christian

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Aalto T, Harjanne M, Vehmas T, Karppinen M, Sitomaniemi A, Malacarne A et al. Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. In 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September. IEEE Institute of Electrical and Electronic Engineers . 2018. p. 1-3 https://doi.org/10.1109/ECOC.2017.8345865