Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips

Timo Aalto, Mikko Harjanne, Tapani Vehmas, Mikko Karppinen, Aila Sitomaniemi, Antonio Malacarne, Christian Neumeyr, Johan Bauwelinck

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported.

    Original languageEnglish
    Title of host publication43rd European Conference on Optical Communication, ECOC 2017
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1-3
    Number of pages3
    Volume2017-September
    ISBN (Electronic)978-1-5386-5624-2
    DOIs
    Publication statusPublished - 24 Apr 2018
    MoE publication typeA4 Article in a conference publication
    Event43rd European Conference on Optical Communication, ECOC 2017 - Gothenburg, Sweden
    Duration: 17 Sep 201721 Sep 2017

    Conference

    Conference43rd European Conference on Optical Communication, ECOC 2017
    CountrySweden
    CityGothenburg
    Period17/09/1721/09/17

    Keywords

    • OtaNano

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  • Cite this

    Aalto, T., Harjanne, M., Vehmas, T., Karppinen, M., Sitomaniemi, A., Malacarne, A., Neumeyr, C., & Bauwelinck, J. (2018). Transceivers for 400G based on Hybrid Integrated Thick SOI and III/V Chips. In 43rd European Conference on Optical Communication, ECOC 2017 (Vol. 2017-September, pp. 1-3). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ECOC.2017.8345865