Transfer of thin Si layers by cold and thermal ion-cutting

Kimmo Henttinen; null Suni; Hannu Luoto; Arto Nurmela; Ilkka Suni; Veli-Matti Airaksinen; S. Lau

Transfer of thin Si layers by cold and thermal ion-cutting

Kimmo Henttinen, Suni, Hannu Luoto, Arto Nurmela, Ilkka Suni, Veli-Matti Airaksinen, S. Lau

VTT Technical Research Centre of Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	Conference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002
Subtitle of host publication	Espoo, FI , 10 - 12 June 2002
Place of Publication	Lontoo
Pages	49-52
Publication status	Published - 2002
MoE publication type	A4 Article in a conference publication
Event	4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002 - Espoo, Finland Duration: 10 Jun 2002 → 12 Jun 2002

Conference

Conference	4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002
Country/Territory	Finland
City	Espoo
Period	10/06/02 → 12/06/02

Keywords

ion-cut
silicon-on-insulator
wafer bonding

Cite this

@inproceedings{177f751cac1643a08e521dd9e4adefed,

title = "Transfer of thin Si layers by cold and thermal ion-cutting",

keywords = "ion-cut, silicon-on-insulator, wafer bonding",

author = "Kimmo Henttinen and Suni and Hannu Luoto and Arto Nurmela and Ilkka Suni and Veli-Matti Airaksinen and S. Lau",

year = "2002",

language = "English",

isbn = "1-86125-155-6",

pages = "49--52",

booktitle = "Conference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002",

note = "4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002 ; Conference date: 10-06-2002 Through 12-06-2002",

}

Henttinen, K, Suni, Luoto, H, Nurmela, A, Suni, I, Airaksinen, V-M & Lau, S 2002, Transfer of thin Si layers by cold and thermal ion-cutting. in Conference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002 : Espoo, FI , 10 - 12 June 2002. Lontoo, pp. 49-52, 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002, Espoo, Finland, 10/06/02.

Transfer of thin Si layers by cold and thermal ion-cutting. / Henttinen, Kimmo; Suni; Luoto, Hannu et al.
Conference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002 : Espoo, FI , 10 - 12 June 2002. Lontoo, 2002. p. 49-52.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Transfer of thin Si layers by cold and thermal ion-cutting

AU - Henttinen, Kimmo

AU - Suni, null

AU - Luoto, Hannu

AU - Nurmela, Arto

AU - Suni, Ilkka

AU - Airaksinen, Veli-Matti

AU - Lau, S.

PY - 2002

Y1 - 2002

KW - ion-cut

KW - silicon-on-insulator

KW - wafer bonding

M3 - Conference article in proceedings

SN - 1-86125-155-6

SP - 49

EP - 52

BT - Conference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002

CY - Lontoo

T2 - 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002

Y2 - 10 June 2002 through 12 June 2002

ER -