Transfer of thin Si layers by cold and thermal ion-cutting

Kimmo Henttinen, Suni, Hannu Luoto, Arto Nurmela, Ilkka Suni, Veli-Matti Airaksinen, S. Lau

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publicationConference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002
Subtitle of host publicationEspoo, FI , 10 - 12 June 2002
Place of PublicationLontoo
Pages49-52
Publication statusPublished - 2002
MoE publication typeA4 Article in a conference publication
Event4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002 - Espoo, Finland
Duration: 10 Jun 200212 Jun 2002

Conference

Conference4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002
CountryFinland
CityEspoo
Period10/06/0212/06/02

Keywords

  • ion-cut
  • silicon-on-insulator
  • wafer bonding

Cite this

Henttinen, K., Suni, Luoto, H., Nurmela, A., Suni, I., Airaksinen, V-M., & Lau, S. (2002). Transfer of thin Si layers by cold and thermal ion-cutting. In Conference Papers 2002. 4th International Conference on Materials for Microelectronics and Nanoengineering, MFMN 2002 : Espoo, FI , 10 - 12 June 2002 (pp. 49-52).