Transport properties of double‐gate SiO2–Si–SiO2 quantum well

Mika Prunnila (Corresponding Author), Jouni Ahopelto, H. Sakaki

    Research output: Contribution to journalArticleScientificpeer-review

    9 Citations (Scopus)

    Abstract

    We report on fabrication and low temperature transport properties of double‐gate SiO2–Si–SiO2 quantum well with a 16.5 nm thick Si layer. The device is fabricated on a silicon‐on‐insulator substrate utilizing wafer bonding, which enables us to use heavily doped back gate. Transport properties of the device are characterized by low field Hall and high field magnetotransport measurements at 4.2 K and at 0.38 K, respectively. Top (back) Si–SiO2 interface peak mobility of 1.9 m2/Vs (1.0 m2/Vs) is measured at 4.2 K. When both gates have a (large) positive bias the Hall carrier density is observed to fall below the value of the expected total carrier density, which is interpreted to arise from the occupancy of the second sub‐band in the Si well. This is confirmed by the high field magnetotransport measurements. In quantizing magnetic fields the longitudinal resistivity minima show Landau level filling factor behavior which is typical for weakly coupled bi‐layers.
    Original languageEnglish
    Pages (from-to)970 - 976
    Number of pages7
    JournalPhysica Status Solidi A: Applications and Materials Science
    Volume202
    Issue number6
    DOIs
    Publication statusPublished - 2005
    MoE publication typeA1 Journal article-refereed

    Keywords

    • quantum wells
    • wafer bonding

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