Tulevaisuuden elektroniikan pakkaus- ja komponenttitekniikat

Translated title of the contribution: Packaging and component technologies of future electronics

Jaakko Lenkkeri, Tero Majamaa, Tuomo Jaakola, Mikko Karppinen, Terho Kololuoma

    Research output: Book/Report › Report

    Fingerprint

    Dive into the research topics of 'Packaging and component technologies of future electronics'. Together they form a unique fingerprint.

    Keyphrases

    INIS