Abstract
This thesis deals with the design, realisation, and
testing of the wavelength tunable 1540-nm laser
prototypes that are intended for fibre optic
communications. The short external cavity laser uses an
electrically controlled silicon micromachined Fabry-Perot
interferometer (FPI) device as the tuning element. First,
the most common techniques for the diode laser wavelength
tuning and applications for these devices are reviewed.
Then the ways of coupling laser power into the
single-mode (SM) optical fibre are considered and the
characteristics of the fibre attachment methods are
studied. The design, assembly and testing of three
prototypes is introduced. Their discontinuous tuning
spans range between 8 and 13 nm and their output power
between 100 and 570 µW. The modules produce multimode
tuning having an rms spectral width of about 1 nm. In
addition, one prototype is capable of single-mode tuning
with a side mode suppression ratio of 26 dB. The measured
wavelength span is the widest reported single-mode tuning
range obtained from a short external cavity Fabry-Perot
diode laser without temperature tuning. The laser module
can be electrically modulated up to over 600 MHz. The
test results show that the FPI-tuned diode lasers can
provide a cost-effective solution for optical
communication applications. The study also confirms that
it is possible to realise the laser-to-SM-fibre coupling
using adhesive bonding. Further studies are needed in
order to improve the speed and repeatibility of the
process together with the reliability of the fibre
attachment. In addition, the operational and long-term
reliability of the module must be characterised.
Original language | English |
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Qualification | Doctor Degree |
Awarding Institution |
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Supervisors/Advisors |
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Award date | 7 Jun 2004 |
Place of Publication | Espoo |
Publisher | |
Print ISBNs | 951-38-6375-1 |
Electronic ISBNs | 951-38-6376-X |
Publication status | Published - 2004 |
MoE publication type | G4 Doctoral dissertation (monograph) |
Keywords
- Fabry-Perot interferometers (FPI)
- hybrid integrated packaging
- LTCC substrates
- microassembly
- optoelectronic devices
- tunable lasers