Abstract
An attenuator or dissipating element arranged to thermalize radio frequency or lower frequency signals, respectively, comprises: at least a first heat sink and a second heat sink (230, 231, 232, 233) that are capacitively grounded and arranged to provide heat dissipation via electron-phonon coupling; and at least one tunnel junction (220, 221, 222, 223, 224) coupled to the first heat sink and the second heat sink; wherein a combined resistance of the at least one tunnel junction and a heat sink coupled to it is below h/ e 2; and/or a total capacitance of the first heat sink and the second heat sink, respectively, is above e 2/2 k b T, wherein h is the Planck constant, e is the elementary charge, k b is the Boltzmann constant, and T is the minimum operating temperature of the element. Preferably, an array (200) of N rows (204) and M columns (202) of non-superconducting metal-insulator-metal tunnel junctions is employed.
Patent family as of 18.12.2024
AU2022332648 AA 20240307 AU20220332648 20220823
CA3229164 AA 20240215 CA20223229164 20220823
CN117957766 A 20240430 CN202280057417 20220823
EP4393061 A1 20240703 EP20220761573 20220823
JP2024530270 T2 20240816 JP20240511967T 20220823
WO23025985 A1 20230302 WO2022FI50541 20220823
| Original language | English |
|---|---|
| Patent number | EP4393061 A1 |
| Priority date | 23/08/21 |
| Publication status | Published - 2 Mar 2024 |
| MoE publication type | Not Eligible |
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