Ultra-wideband shielded vertical via transitions from DC up to the V-band

T. Kangasvieri, J. Halme, J. Vähäkangas, Markku Lahti

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    This paper presents three shielded vertical via transition designs applicable in millimeter-wave module packaging from DC up to the V-band. The optimized transition structures were fabricated using a standard low-temperature co-fired ceramic (LTCC) process. The measured scattering parameter results of the back-to-back via transition structures showed an exceptionally wide bandwidth with return losses better than 18 dB up to 50 GHz. The extracted insertion loss values of the single transitions were less than about 0.4 dB at 50 GHz. Moreover, full-wave electromagnetic (EM) simulations demonstrated the high potential of two of these via transitions up to 70 GHz.
    Original languageEnglish
    Title of host publicationProceedings of the 1st European Microwave Integrated Circuits Conference, EuMIC 2006
    Subtitle of host publicationManchester, UK, 11 - 15 Sept. 2006
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages476-479
    ISBN (Print)2-9600551-8-7
    DOIs
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication

    Keywords

    • Low-loss
    • Low-temperature co-fired ceramic (LTCC)
    • Transition
    • Wideband

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  • Cite this

    Kangasvieri, T., Halme, J., Vähäkangas, J., & Lahti, M. (2006). Ultra-wideband shielded vertical via transitions from DC up to the V-band. In Proceedings of the 1st European Microwave Integrated Circuits Conference, EuMIC 2006: Manchester, UK, 11 - 15 Sept. 2006 (pp. 476-479). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/EMICC.2006.282686