| Original language | English |
|---|---|
| Title of host publication | Quantitative Nondestructive Evaluation |
| Place of Publication | Melville, New York |
| Publisher | American Institute of Physics AIP |
| Pages | 1582-1586 |
| ISBN (Print) | 0-7354-0173-X |
| DOIs | |
| Publication status | Published - 2004 |
| MoE publication type | Not Eligible |
| Event | Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE - Green Bay, United States Duration: 27 Jul 2003 → 1 Aug 2003 |
Publication series
| Name | AIP Conference Proceedings |
|---|---|
| Publisher | AIP |
| Volume | 700 |
| ISSN (Print) | 1224-1231 |
Conference
| Conference | Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE |
|---|---|
| Country | United States |
| City | Green Bay |
| Period | 27/07/03 → 1/08/03 |
Cite this
Pitkänen, J., Kemppainen, M., & Virkkunen, I. (2004). Ultrasonic study of crack under dynamic thermal load. In Quantitative Nondestructive Evaluation (pp. 1582-1586). Melville, New York: American Institute of Physics AIP. AIP Conference Proceedings, Vol.. 700 https://doi.org/10.1063/1.1711803
@inproceedings{4ccaecb1ffde412793fd291f26227b51,
title = "Ultrasonic study of crack under dynamic thermal load",
author = "Jorma Pitk{\"a}nen and M. Kemppainen and I. Virkkunen",
year = "2004",
doi = "10.1063/1.1711803",
language = "English",
isbn = "0-7354-0173-X",
series = "AIP Conference Proceedings",
publisher = "American Institute of Physics AIP",
pages = "1582--1586",
booktitle = "Quantitative Nondestructive Evaluation",
address = "United States",
}
Pitkänen, J, Kemppainen, M & Virkkunen, I 2004, Ultrasonic study of crack under dynamic thermal load. in Quantitative Nondestructive Evaluation. American Institute of Physics AIP, Melville, New York, AIP Conference Proceedings, vol. 700, pp. 1582-1586, Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE, Green Bay, United States, 27/07/03. https://doi.org/10.1063/1.1711803
Ultrasonic study of crack under dynamic thermal load. / Pitkänen, Jorma; Kemppainen, M.; Virkkunen, I.
Quantitative Nondestructive Evaluation. Melville, New York : American Institute of Physics AIP, 2004. p. 1582-1586 (AIP Conference Proceedings, Vol. 700).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific
TY - GEN
T1 - Ultrasonic study of crack under dynamic thermal load
AU - Pitkänen, Jorma
AU - Kemppainen, M.
AU - Virkkunen, I.
PY - 2004
Y1 - 2004
U2 - 10.1063/1.1711803
DO - 10.1063/1.1711803
M3 - Conference article in proceedings
SN - 0-7354-0173-X
T3 - AIP Conference Proceedings
SP - 1582
EP - 1586
BT - Quantitative Nondestructive Evaluation
PB - American Institute of Physics AIP
CY - Melville, New York
ER -
Pitkänen J, Kemppainen M, Virkkunen I. Ultrasonic study of crack under dynamic thermal load. In Quantitative Nondestructive Evaluation. Melville, New York: American Institute of Physics AIP. 2004. p. 1582-1586. (AIP Conference Proceedings, Vol. 700). https://doi.org/10.1063/1.1711803