Ultrasonic study of crack under dynamic thermal load

Jorma Pitkänen, M. Kemppainen, I. Virkkunen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publicationQuantitative Nondestructive Evaluation
Place of PublicationMelville, New York
PublisherAmerican Institute of Physics AIP
Pages1582-1586
ISBN (Print)0-7354-0173-X
DOIs
Publication statusPublished - 2004
MoE publication typeNot Eligible
EventReview of Progress in Quantitative Nondestructive Evaluation Conference, QNDE - Green Bay, United States
Duration: 27 Jul 20031 Aug 2003

Publication series

SeriesAIP Conference Proceedings
Volume700
ISSN0094-243X

Conference

ConferenceReview of Progress in Quantitative Nondestructive Evaluation Conference, QNDE
CountryUnited States
CityGreen Bay
Period27/07/031/08/03

Cite this

Pitkänen, J., Kemppainen, M., & Virkkunen, I. (2004). Ultrasonic study of crack under dynamic thermal load. In Quantitative Nondestructive Evaluation (pp. 1582-1586). Melville, New York: American Institute of Physics AIP. AIP Conference Proceedings, Vol.. 700 https://doi.org/10.1063/1.1711803
Pitkänen, Jorma ; Kemppainen, M. ; Virkkunen, I. / Ultrasonic study of crack under dynamic thermal load. Quantitative Nondestructive Evaluation. Melville, New York : American Institute of Physics AIP, 2004. pp. 1582-1586 (AIP Conference Proceedings, Vol. 700).
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title = "Ultrasonic study of crack under dynamic thermal load",
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isbn = "0-7354-0173-X",
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Pitkänen, J, Kemppainen, M & Virkkunen, I 2004, Ultrasonic study of crack under dynamic thermal load. in Quantitative Nondestructive Evaluation. American Institute of Physics AIP, Melville, New York, AIP Conference Proceedings, vol. 700, pp. 1582-1586, Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE, Green Bay, United States, 27/07/03. https://doi.org/10.1063/1.1711803

Ultrasonic study of crack under dynamic thermal load. / Pitkänen, Jorma; Kemppainen, M.; Virkkunen, I.

Quantitative Nondestructive Evaluation. Melville, New York : American Institute of Physics AIP, 2004. p. 1582-1586 (AIP Conference Proceedings, Vol. 700).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

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T1 - Ultrasonic study of crack under dynamic thermal load

AU - Pitkänen, Jorma

AU - Kemppainen, M.

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Y1 - 2004

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DO - 10.1063/1.1711803

M3 - Conference article in proceedings

SN - 0-7354-0173-X

T3 - AIP Conference Proceedings

SP - 1582

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BT - Quantitative Nondestructive Evaluation

PB - American Institute of Physics AIP

CY - Melville, New York

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Pitkänen J, Kemppainen M, Virkkunen I. Ultrasonic study of crack under dynamic thermal load. In Quantitative Nondestructive Evaluation. Melville, New York: American Institute of Physics AIP. 2004. p. 1582-1586. (AIP Conference Proceedings, Vol. 700). https://doi.org/10.1063/1.1711803