Ultrasonic study of crack under dynamic thermal load

Jorma Pitkänen; M. Kemppainen; I. Virkkunen

doi:10.1063/1.1711803

Ultrasonic study of crack under dynamic thermal load

Jorma Pitkänen, M. Kemppainen, I. Virkkunen

VTT Technical Research Centre of Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	Quantitative Nondestructive Evaluation
Place of Publication	Melville, New York
Publisher	American Institute of Physics AIP
Pages	1582-1586
ISBN (Print)	0-7354-0173-X
DOIs	https://doi.org/10.1063/1.1711803
Publication status	Published - 2004
MoE publication type	Not Eligible
Event	Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE - Green Bay, United States Duration: 27 Jul 2003 → 1 Aug 2003

Publication series

Series	AIP Conference Proceedings
Volume	700
ISSN	0094-243X

Conference

Conference	Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE
Country	United States
City	Green Bay
Period	27/07/03 → 1/08/03

Cite this

Pitkänen, J., Kemppainen, M., & Virkkunen, I. (2004). Ultrasonic study of crack under dynamic thermal load. In Quantitative Nondestructive Evaluation (pp. 1582-1586). American Institute of Physics AIP. AIP Conference Proceedings, Vol.. 700 https://doi.org/10.1063/1.1711803

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title = "Ultrasonic study of crack under dynamic thermal load",

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year = "2004",

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language = "English",

isbn = "0-7354-0173-X",

series = "AIP Conference Proceedings",

publisher = "American Institute of Physics AIP",

pages = "1582--1586",

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note = "Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE ; Conference date: 27-07-2003 Through 01-08-2003",

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Pitkänen, J, Kemppainen, M & Virkkunen, I 2004, Ultrasonic study of crack under dynamic thermal load. in Quantitative Nondestructive Evaluation. American Institute of Physics AIP, Melville, New York, AIP Conference Proceedings, vol. 700, pp. 1582-1586, Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE, Green Bay, United States, 27/07/03. https://doi.org/10.1063/1.1711803

Ultrasonic study of crack under dynamic thermal load. / Pitkänen, Jorma; Kemppainen, M.; Virkkunen, I.

Quantitative Nondestructive Evaluation. Melville, New York : American Institute of Physics AIP, 2004. p. 1582-1586 (AIP Conference Proceedings, Vol. 700).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - Ultrasonic study of crack under dynamic thermal load

AU - Pitkänen, Jorma

AU - Kemppainen, M.

AU - Virkkunen, I.

PY - 2004

Y1 - 2004

U2 - 10.1063/1.1711803

DO - 10.1063/1.1711803

M3 - Conference article in proceedings

SN - 0-7354-0173-X

T3 - AIP Conference Proceedings

SP - 1582

EP - 1586

BT - Quantitative Nondestructive Evaluation

PB - American Institute of Physics AIP

CY - Melville, New York

T2 - Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE

Y2 - 27 July 2003 through 1 August 2003

ER -

Access to Document

10.1063/1.1711803