Ultrasonic study of crack under dynamic thermal load

Jorma Pitkänen, M. Kemppainen, I. Virkkunen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publicationQuantitative Nondestructive Evaluation
Place of PublicationMelville, New York
PublisherAmerican Institute of Physics AIP
Pages1582-1586
ISBN (Print)0-7354-0173-X
DOIs
Publication statusPublished - 2004
MoE publication typeNot Eligible
EventReview of Progress in Quantitative Nondestructive Evaluation Conference, QNDE - Green Bay, United States
Duration: 27 Jul 20031 Aug 2003

Publication series

SeriesAIP Conference Proceedings
Volume700
ISSN0094-243X

Conference

ConferenceReview of Progress in Quantitative Nondestructive Evaluation Conference, QNDE
CountryUnited States
CityGreen Bay
Period27/07/031/08/03

Cite this

Pitkänen, J., Kemppainen, M., & Virkkunen, I. (2004). Ultrasonic study of crack under dynamic thermal load. In Quantitative Nondestructive Evaluation (pp. 1582-1586). American Institute of Physics AIP. AIP Conference Proceedings, Vol.. 700 https://doi.org/10.1063/1.1711803