Abstract
Results of wafer level packaging for
micro-electro-mechanical systems based on low temperature
melting metallurgy are going to be presented. The MEMS
are packaged under vacuum with internal pressure in the
range of 1 mbar after sealing. Through Silicon Vias in a
silicon interposer allow the feeding of the electrical
contacts to the package outside. The thin silicon
interposer acts as MEMS carrier or lid and therefore is
part of the final packaged component after dicing. AuSn
rings have been chosen for process compatibility with the
MEMS and ensure the hermeticity of the components after
vacuum sealing. Evaluation of the bond process is carried
out using XRay imaging microscopy, analysis of cross
sections and the final package resistance is evaluated
using shear testing. The thickness of the chip-scale
packaged MEMS is smaller than 500 µm and a yield of
vacuum sealing of around 80% was obtained in first
evaluation on 200 mm wafer scale
| Original language | English |
|---|---|
| Title of host publication | 2013 European Microelectronics Packaging Conference (EMPC) |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Number of pages | 8 |
| ISBN (Print) | 978-2-9527-4671-7 |
| Publication status | Published - 2013 |
| MoE publication type | A4 Article in a conference publication |
| Event | EMPC 2013: European Microelectronics and Packaging Conference - Grenoble, France Duration: 9 Sept 2013 → 12 Sept 2013 |
Conference
| Conference | EMPC 2013 |
|---|---|
| Country/Territory | France |
| City | Grenoble |
| Period | 9/09/13 → 12/09/13 |
Keywords
- Au/Sn
- interposer
- MEMS
- sealing
- vacuum
- WLP