Vacuum packaging at wafer level for MEMS using gold-tin metallurgy

C.-A. Manier, K. Zoschke, H. Oppermann, D. Ruffieux, S Dalla Piazza, Tommi Suni, James Dekker, G. Allegato

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

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Physics & Astronomy