Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging

Fan Ji (Corresponding Author), Juha Kalliopuska, Simo Eränen, Mikko Juntunen, Iiro Hietanen, Seppo Leppävuori

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Abstract

This paper presents a new design of the silicon-based photodiode detector for medical imaging, especially for the X-ray computed tomography applications. The new structure of the photodiode includes a conventional front-illuminated photodiode and a through wafer interconnection. Moreover, the through wafer interconnection is integrated into the photodiode by being placed inside the active area of the photodiode. This new structure is called via-in-pixel design. Truly 2D photodiode detector can be designed with maximum free space or minimum gap between each two photodiode elements by using the via-in-pixel design. In addition, 2D photodiode detector arrays can be constructed by tiling more edgeless detectors. In the paper, the via-in-pixel photodiodes were demonstrated and the performances were measured. Together with the measurement data, a quasi-3D device simulation was performed to disclose the electrical characteristics of the via-in-pixel photodiode by using Synopsis Advanced TCAD software. The results show that the via-in-pixel design of the photodiode detector can either meet or exceed the medical imaging requirements.
Original languageEnglish
Pages (from-to)59-65
JournalSensors and Actuators A: Physical
Volume145-146
DOIs
Publication statusPublished - 2008
MoE publication typeA1 Journal article-refereed

Fingerprint

Photodiodes
photodiodes
Pixels
pixels
Detectors
Imaging techniques
detectors
Medical imaging
wafers
Silicon
Tomography
tomography
computer programs
X rays
requirements

Keywords

  • Via-in-pixel design
  • Computed tomography
  • Photodiode detector
  • Through wafer interconnection

Cite this

Ji, F., Kalliopuska, J., Eränen, S., Juntunen, M., Hietanen, I., & Leppävuori, S. (2008). Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging. Sensors and Actuators A: Physical, 145-146, 59-65. https://doi.org/10.1016/j.sna.2007.10.044
Ji, Fan ; Kalliopuska, Juha ; Eränen, Simo ; Juntunen, Mikko ; Hietanen, Iiro ; Leppävuori, Seppo. / Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging. In: Sensors and Actuators A: Physical. 2008 ; Vol. 145-146. pp. 59-65.
@article{f3f437b2cdd943cc8e0f3d620640df84,
title = "Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging",
abstract = "This paper presents a new design of the silicon-based photodiode detector for medical imaging, especially for the X-ray computed tomography applications. The new structure of the photodiode includes a conventional front-illuminated photodiode and a through wafer interconnection. Moreover, the through wafer interconnection is integrated into the photodiode by being placed inside the active area of the photodiode. This new structure is called via-in-pixel design. Truly 2D photodiode detector can be designed with maximum free space or minimum gap between each two photodiode elements by using the via-in-pixel design. In addition, 2D photodiode detector arrays can be constructed by tiling more edgeless detectors. In the paper, the via-in-pixel photodiodes were demonstrated and the performances were measured. Together with the measurement data, a quasi-3D device simulation was performed to disclose the electrical characteristics of the via-in-pixel photodiode by using Synopsis Advanced TCAD software. The results show that the via-in-pixel design of the photodiode detector can either meet or exceed the medical imaging requirements.",
keywords = "Via-in-pixel design, Computed tomography, Photodiode detector, Through wafer interconnection",
author = "Fan Ji and Juha Kalliopuska and Simo Er{\"a}nen and Mikko Juntunen and Iiro Hietanen and Seppo Lepp{\"a}vuori",
year = "2008",
doi = "10.1016/j.sna.2007.10.044",
language = "English",
volume = "145-146",
pages = "59--65",
journal = "Sensors and Actuators A: Physical",
issn = "0924-4247",
publisher = "Elsevier",

}

Ji, F, Kalliopuska, J, Eränen, S, Juntunen, M, Hietanen, I & Leppävuori, S 2008, 'Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging', Sensors and Actuators A: Physical, vol. 145-146, pp. 59-65. https://doi.org/10.1016/j.sna.2007.10.044

Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging. / Ji, Fan (Corresponding Author); Kalliopuska, Juha; Eränen, Simo; Juntunen, Mikko; Hietanen, Iiro; Leppävuori, Seppo.

In: Sensors and Actuators A: Physical, Vol. 145-146, 2008, p. 59-65.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging

AU - Ji, Fan

AU - Kalliopuska, Juha

AU - Eränen, Simo

AU - Juntunen, Mikko

AU - Hietanen, Iiro

AU - Leppävuori, Seppo

PY - 2008

Y1 - 2008

N2 - This paper presents a new design of the silicon-based photodiode detector for medical imaging, especially for the X-ray computed tomography applications. The new structure of the photodiode includes a conventional front-illuminated photodiode and a through wafer interconnection. Moreover, the through wafer interconnection is integrated into the photodiode by being placed inside the active area of the photodiode. This new structure is called via-in-pixel design. Truly 2D photodiode detector can be designed with maximum free space or minimum gap between each two photodiode elements by using the via-in-pixel design. In addition, 2D photodiode detector arrays can be constructed by tiling more edgeless detectors. In the paper, the via-in-pixel photodiodes were demonstrated and the performances were measured. Together with the measurement data, a quasi-3D device simulation was performed to disclose the electrical characteristics of the via-in-pixel photodiode by using Synopsis Advanced TCAD software. The results show that the via-in-pixel design of the photodiode detector can either meet or exceed the medical imaging requirements.

AB - This paper presents a new design of the silicon-based photodiode detector for medical imaging, especially for the X-ray computed tomography applications. The new structure of the photodiode includes a conventional front-illuminated photodiode and a through wafer interconnection. Moreover, the through wafer interconnection is integrated into the photodiode by being placed inside the active area of the photodiode. This new structure is called via-in-pixel design. Truly 2D photodiode detector can be designed with maximum free space or minimum gap between each two photodiode elements by using the via-in-pixel design. In addition, 2D photodiode detector arrays can be constructed by tiling more edgeless detectors. In the paper, the via-in-pixel photodiodes were demonstrated and the performances were measured. Together with the measurement data, a quasi-3D device simulation was performed to disclose the electrical characteristics of the via-in-pixel photodiode by using Synopsis Advanced TCAD software. The results show that the via-in-pixel design of the photodiode detector can either meet or exceed the medical imaging requirements.

KW - Via-in-pixel design

KW - Computed tomography

KW - Photodiode detector

KW - Through wafer interconnection

U2 - 10.1016/j.sna.2007.10.044

DO - 10.1016/j.sna.2007.10.044

M3 - Article

VL - 145-146

SP - 59

EP - 65

JO - Sensors and Actuators A: Physical

JF - Sensors and Actuators A: Physical

SN - 0924-4247

ER -