Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging

Fan Ji; Mikko Juntunen; Simo Eränen; Seppo Leppävuori; Iiro Hietanen

doi:10.1109/SENSOR.2007.4300587

Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging

Fan Ji, Mikko Juntunen, Simo Eränen, Seppo Leppävuori, Iiro Hietanen

VTT Technical Research Centre of Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

This paper presents an advanced design of the photodiode detector for medical imaging, especially for the X-ray computed tomography applications. In this paper, through wafer interconnection technology with via-in-pixel design is utilized to achieve the truly 2D extendable feature of the photodiode detector. The active area of each photodiode element on the detector can achieve the maximum active area with the fixed pitch size. Comparing to the via-off-pixel design, different parameters of the photodiode with via-in-pixel design were measured and analyzed from the demonstrated samples. The results show that the performances of the samples either meet or exceed the requirements of the modern X-ray computed tomography applications.

Original language	English
Title of host publication	TRANSDUCERS 2007 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	2131-2134
ISBN (Electronic)	1-4244-0842-3
ISBN (Print)	1-4244-0841-5
DOIs	https://doi.org/10.1109/SENSOR.2007.4300587
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems - Lyon, France Duration: 10 Jun 2007 → 14 Jun 2007

Conference

Conference	TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
Country/Territory	France
City	Lyon
Period	10/06/07 → 14/06/07

Keywords

Computed tomography
Photodiode detector
Through wafer interconnection

Access to Document

10.1109/SENSOR.2007.4300587

Cite this

Ji, F., Juntunen, M., Eränen, S., Leppävuori, S., & Hietanen, I. (2007). Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging. In TRANSDUCERS 2007 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 2131-2134). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/SENSOR.2007.4300587

@inproceedings{3ec4b8f83e724141815732efcf689c6f,

title = "Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging",

abstract = "This paper presents an advanced design of the photodiode detector for medical imaging, especially for the X-ray computed tomography applications. In this paper, through wafer interconnection technology with via-in-pixel design is utilized to achieve the truly 2D extendable feature of the photodiode detector. The active area of each photodiode element on the detector can achieve the maximum active area with the fixed pitch size. Comparing to the via-off-pixel design, different parameters of the photodiode with via-in-pixel design were measured and analyzed from the demonstrated samples. The results show that the performances of the samples either meet or exceed the requirements of the modern X-ray computed tomography applications.",

keywords = "Computed tomography, Photodiode detector, Through wafer interconnection",

author = "Fan Ji and Mikko Juntunen and Simo Er{\"a}nen and Seppo Lepp{\"a}vuori and Iiro Hietanen",

year = "2007",

doi = "10.1109/SENSOR.2007.4300587",

language = "English",

isbn = "1-4244-0841-5",

pages = "2131--2134",

booktitle = "TRANSDUCERS 2007 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems ; Conference date: 10-06-2007 Through 14-06-2007",

}

Ji, F, Juntunen, M, Eränen, S, Leppävuori, S & Hietanen, I 2007, Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging. in TRANSDUCERS 2007 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. IEEE Institute of Electrical and Electronic Engineers, pp. 2131-2134, TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, Lyon, France, 10/06/07. https://doi.org/10.1109/SENSOR.2007.4300587

Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging. / Ji, Fan; Juntunen, Mikko; Eränen, Simo et al.

TRANSDUCERS 2007 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. IEEE Institute of Electrical and Electronic Engineers, 2007. p. 2131-2134.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging

AU - Ji, Fan

AU - Juntunen, Mikko

AU - Eränen, Simo

AU - Leppävuori, Seppo

AU - Hietanen, Iiro

PY - 2007

Y1 - 2007

N2 - This paper presents an advanced design of the photodiode detector for medical imaging, especially for the X-ray computed tomography applications. In this paper, through wafer interconnection technology with via-in-pixel design is utilized to achieve the truly 2D extendable feature of the photodiode detector. The active area of each photodiode element on the detector can achieve the maximum active area with the fixed pitch size. Comparing to the via-off-pixel design, different parameters of the photodiode with via-in-pixel design were measured and analyzed from the demonstrated samples. The results show that the performances of the samples either meet or exceed the requirements of the modern X-ray computed tomography applications.

AB - This paper presents an advanced design of the photodiode detector for medical imaging, especially for the X-ray computed tomography applications. In this paper, through wafer interconnection technology with via-in-pixel design is utilized to achieve the truly 2D extendable feature of the photodiode detector. The active area of each photodiode element on the detector can achieve the maximum active area with the fixed pitch size. Comparing to the via-off-pixel design, different parameters of the photodiode with via-in-pixel design were measured and analyzed from the demonstrated samples. The results show that the performances of the samples either meet or exceed the requirements of the modern X-ray computed tomography applications.

KW - Computed tomography

KW - Photodiode detector

KW - Through wafer interconnection

U2 - 10.1109/SENSOR.2007.4300587

DO - 10.1109/SENSOR.2007.4300587

M3 - Conference article in proceedings

SN - 1-4244-0841-5

SP - 2131

EP - 2134

BT - TRANSDUCERS 2007 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Y2 - 10 June 2007 through 14 June 2007

ER -

Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging

Abstract

Conference

Keywords

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