Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
- Tommi Suni
- , Hongbo Xu
- , V. Vuorinen
- , Hannele Heikkinen
- , Sami Vähänen
- , Antti Jaakkola
- , Philippe Monnoyer
- , Mervi Paulasto-Kröckel
- Aalto University
- Advacam Oy
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
8
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(Scopus)