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Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Tommi Suni, Hongbo Xu, V. Vuorinen, Hannele Heikkinen, Sami Vähänen, Antti Jaakkola, Philippe Monnoyer, Mervi Paulasto-Kröckel
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
7
Citations
(Scopus)