Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Tommi Suni, Hongbo Xu, V. Vuorinen, Hannele Heikkinen, S. Vähänen, Antti Jaakkola, Philippe Monnoyer, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

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