Fingerprint
Dive into the research topics of 'Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Tommi Suni, Hongbo Xu, V. Vuorinen, Hannele Heikkinen, S. Vähänen, Antti Jaakkola, Philippe Monnoyer, Mervi Paulasto-Kröckel
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
6
Citations
(Scopus)