Wafer level MEMS encapsulation using SLID bonding

Tommi Suni, H Xu, Hannele Heikkinen, James Dekker, V Vuorinen, Antti Jaakkola, Philippe Monnoyer, M Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

Abstract

We have studied copper-tin and gold-tin solid-liquid interdiffusion bonding for MEMS encapsulation. Different electroplating processes, seal ring thicknesses and bonding processes were tested. Bonding quality was studied with cross sectional scanning electron microscopy.
Original languageEnglish
Title of host publicationBook of abstracts
Place of PublicationStockholm
Pages105-106
Publication statusPublished - 2013
MoE publication typeNot Eligible
EventInternational Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13 - Stockholm, Sweden
Duration: 5 Dec 20136 Dec 2013

Conference

ConferenceInternational Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13
Abbreviated titleWaferbond'13
CountrySweden
CityStockholm
Period5/12/136/12/13

Keywords

  • MEMS packaging
  • SLID bonding

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  • Cite this

    Suni, T., Xu, H., Heikkinen, H., Dekker, J., Vuorinen, V., Jaakkola, A., Monnoyer, P., & Paulasto-Kröckel, M. (2013). Wafer level MEMS encapsulation using SLID bonding. In Book of abstracts (pp. 105-106).