Wafer level MEMS encapsulation using SLID bonding

Tommi Suni, H Xu, Hannele Heikkinen, James Dekker, V Vuorinen, Antti Jaakkola, Philippe Monnoyer, M Paulasto-Kröckel

    Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific

    Abstract

    We have studied copper-tin and gold-tin solid-liquid interdiffusion bonding for MEMS encapsulation. Different electroplating processes, seal ring thicknesses and bonding processes were tested. Bonding quality was studied with cross sectional scanning electron microscopy.
    Original languageEnglish
    Title of host publicationBook of abstracts
    Place of PublicationStockholm
    Pages105-106
    Publication statusPublished - 2013
    MoE publication typeNot Eligible
    EventInternational Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13 - Stockholm, Sweden
    Duration: 5 Dec 20136 Dec 2013

    Conference

    ConferenceInternational Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13
    Abbreviated titleWaferbond'13
    Country/TerritorySweden
    CityStockholm
    Period5/12/136/12/13

    Keywords

    • MEMS packaging
    • SLID bonding

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