Abstract
We have studied copper-tin and gold-tin solid-liquid interdiffusion bonding for MEMS encapsulation. Different electroplating processes, seal ring thicknesses and bonding processes were tested. Bonding quality was studied with cross sectional scanning electron microscopy.
Original language | English |
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Title of host publication | Book of abstracts |
Place of Publication | Stockholm |
Pages | 105-106 |
Publication status | Published - 2013 |
MoE publication type | Not Eligible |
Event | International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13 - Stockholm, Sweden Duration: 5 Dec 2013 → 6 Dec 2013 |
Conference
Conference | International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13 |
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Abbreviated title | Waferbond'13 |
Country/Territory | Sweden |
City | Stockholm |
Period | 5/12/13 → 6/12/13 |
Keywords
- MEMS packaging
- SLID bonding