Abstract
We have studied copper-tin and gold-tin solid-liquid interdiffusion bonding for MEMS encapsulation. Different electroplating processes, seal ring thicknesses and bonding processes were tested. Bonding quality was studied with cross sectional scanning electron microscopy.
| Original language | English |
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| Title of host publication | Book of abstracts |
| Place of Publication | Stockholm |
| Pages | 105-106 |
| Publication status | Published - 2013 |
| MoE publication type | Not Eligible |
| Event | International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13 - Stockholm, Sweden Duration: 5 Dec 2013 → 6 Dec 2013 |
Conference
| Conference | International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration, Waferbond'13 |
|---|---|
| Abbreviated title | Waferbond'13 |
| Country/Territory | Sweden |
| City | Stockholm |
| Period | 5/12/13 → 6/12/13 |
Keywords
- MEMS packaging
- SLID bonding