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Wafer level package for device
Jae-Wung Lee
(Inventor)
BA7502 Photonics and superconducting electronics
Research output
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Patent
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Patent
Overview
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INIS
levels
100%
devices
100%
substrates
100%
connections
83%
layers
33%
surfaces
33%
bonding
33%
patents
16%
inventions
16%
Keyphrases
Electrical Connection
100%
Wafer Level Package
100%
Connection Line
100%
Standoff
75%
Bonding Layer
50%
Patent Family
25%
Lateral Interactions
25%
Engineering
Electrical Connection
100%
Bonding Layer
50%
Patent Family
25%