Wafer level packaging for hermetical encapsulation of MEMS resonators

C.-A. Manier, K. Zoschke, H. Oppermann, D. Ruffieux, Silvio Dalla Piazza, Tommi Suni, J. Dekker, G. Allegato

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Fingerprint Dive into the research topics of 'Wafer level packaging for hermetical encapsulation of MEMS resonators'. Together they form a unique fingerprint.

Physics & Astronomy