Wafer level packaging for hermetical encapsulation of MEMS resonators

  • C.-A. Manier
  • , K. Zoschke
  • , H. Oppermann
  • , D. Ruffieux
  • , Silvio Dalla Piazza
  • , Tommi Suni
  • , James Dekker
  • , G. Allegato

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

9 Citations (Scopus)

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Engineering

Material Science