Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
- Charles-Alix Manier
- , Kai Zoschke
- , Martin Wilke
- , Hermann Oppermann
- , David Ruffieux
- , Silvio Dalla Piazza
- , Tommi Suni
- , James Dekker
- , Giorgio Allegato
- , Klaus-Dieter Lang
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Centre Suisse d'Electronique et de Microtechnique S.A. (CSEM)
- Micro Crystal AG
- STMicroelectronics S.r.l.
- Technical University of Berlin
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
9
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(Scopus)