Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Charles-Alix Manier, Kai Zoschke, Martin Wilke, Hermann Oppermann, David Ruffieux, Silvio Dalla Piazza, Tommi Suni, James Dekker, Giorgio Allegato, Klaus-Dieter Lang

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

3 Citations (Scopus)

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Engineering & Materials Science