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Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Charles-Alix Manier, Kai Zoschke, Martin Wilke, Hermann Oppermann, David Ruffieux, Silvio Dalla Piazza, Tommi Suni, James Dekker, Giorgio Allegato, Klaus-Dieter Lang
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
6
Citations
(Scopus)