@inproceedings{38baffa52f98468f8fdb50f62294e72d,
title = "Wafer scale packaging of MEMS by using plasma activated wafer bonding",
abstract = "Plasma assisted bonding is investigated for wafer scale encapsulation of MEMS. As direct bonding requires smooth and planar surfaces, CVD oxides are deposited on top of the structures and subsequently planarized by CMP. Care has to be taken in order to avoid rounding of the structures. This is done by a specially developed polishing sequence. Furthermore, two methods of forming electrical contacts to the devices are presented. Viability of the processes is done by testing of a sealed polysilicon resonator structure.",
keywords = "wafer level packaging, direct bonding, plasma activation, polysilicon resonator, CMP, MEMS",
author = "Tommi Suni and Kimmo Henttinen and Antti Lipsanen and James Dekker and Hannu Luoto and Martin Kulawski",
note = "Project code: T5SU00314; 8th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications : Part of the 2005 Spring Meeting of the Electrochemical Society ; Conference date: 15-05-2005 Through 20-05-2005",
year = "2005",
language = "English",
isbn = "1-56677-460-8",
series = "ECS Proceedings Volumes",
publisher = "Electrochemical Society ECS",
pages = "173--183",
booktitle = "Semiconductor Wafer Bonding VIII: Science, Technology and Applications",
address = "United States",
}