Wafer scale packaging of MEMS by using plasma activated wafer bonding

Tommi Suni, Kimmo Henttinen, Antti Lipsanen, James Dekker, Hannu Luoto, Martin Kulawski

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)

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    Engineering

    Material Science