Wavelength-tunable laser module using low-temperature cofired ceramic substrates

Veli Heikkinen (Corresponding Author), Janne Aikio, Teemu Alajoki, Kari Kautio, Jyrki Ollila, Pentti Karioja

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)

Abstract

We realized a prototype series of the 1550-nm band wavelength-tunable laser module. The edge-emitting Fabry-Perot diode laser operates in the short external cavity configuration and is tuned by a silicon surface micromachined Fabry-Peacuterot interferometer device. Low-temperature cofired ceramic (LTCC) substrate technology was used in the module packaging to enable the passive alignment of the photonic components. Low conductor resistance and dielectric loss, multilayer structures with fine-line capability, compatibility with hermetic sealing, and the ability to integrate passive electrical components (resistors, capacitors, and inductors) into the substrate make LTCC a useful technology for telecommunication applications. In addition, the fair match of the thermal expansion coefficient to optoelectronic chips reduces packaging-induced thermomechanical stresses. The precision three-dimensional (3-D) structures, such as cavities, holes, and channels manufactured in the ceramic parts, ease the packaging process via the passive assembly. The wavelength tuning range of the realized modules ranged from 8 to 19 nm and single-mode fiber-coupled output power was between 100 and 570 muW. The hybrid arrangement uses standard laser chips and, therefore, potentially provides a cost-effective and easily configurable solution for last-mile fiber optic communications.
Original languageEnglish
Pages (from-to)121 - 127
Number of pages7
JournalIEEE Transactions on Advanced Packaging
Volume28
Issue number1
DOIs
Publication statusPublished - 2005
MoE publication typeA1 Journal article-refereed

Fingerprint

Laser tuning
Packaging
Wavelength
Substrates
Single mode fibers
Dielectric losses
Resistors
Optoelectronic devices
Interferometers
Temperature
Photonics
Fiber optics
Thermal expansion
Telecommunication
Semiconductor lasers
Multilayers
Capacitors
Tuning
Silicon
Lasers

Keywords

  • Fabry-Perot interferometers
  • ceramic packaging
  • packaging
  • integrated optoelectronics
  • laser tuning
  • microassembly
  • semiconductor lasers
  • conductor resistance
  • dielectric loss
  • fiber optic communications
  • fine-line capability
  • hermetic sealing
  • hybrid integrated circuit packaging
  • integrated passive electrical components
  • laser chips
  • low-temperature cofired ceramic substrates
  • microassembly technique
  • module packaging
  • multilayer structures
  • optoelectronic chips
  • packaging-induced thermomechanical stresses
  • passive alignment
  • passive assembly
  • photonic components
  • precision 3D structures
  • short external cavity configuration
  • silicon surface

Cite this

@article{d23b150b0913451ca532305d98a32456,
title = "Wavelength-tunable laser module using low-temperature cofired ceramic substrates",
abstract = "We realized a prototype series of the 1550-nm band wavelength-tunable laser module. The edge-emitting Fabry-Perot diode laser operates in the short external cavity configuration and is tuned by a silicon surface micromachined Fabry-Peacuterot interferometer device. Low-temperature cofired ceramic (LTCC) substrate technology was used in the module packaging to enable the passive alignment of the photonic components. Low conductor resistance and dielectric loss, multilayer structures with fine-line capability, compatibility with hermetic sealing, and the ability to integrate passive electrical components (resistors, capacitors, and inductors) into the substrate make LTCC a useful technology for telecommunication applications. In addition, the fair match of the thermal expansion coefficient to optoelectronic chips reduces packaging-induced thermomechanical stresses. The precision three-dimensional (3-D) structures, such as cavities, holes, and channels manufactured in the ceramic parts, ease the packaging process via the passive assembly. The wavelength tuning range of the realized modules ranged from 8 to 19 nm and single-mode fiber-coupled output power was between 100 and 570 muW. The hybrid arrangement uses standard laser chips and, therefore, potentially provides a cost-effective and easily configurable solution for last-mile fiber optic communications.",
keywords = "Fabry-Perot interferometers, ceramic packaging, packaging, integrated optoelectronics, laser tuning, microassembly, semiconductor lasers, conductor resistance, dielectric loss, fiber optic communications, fine-line capability, hermetic sealing, hybrid integrated circuit packaging, integrated passive electrical components, laser chips, low-temperature cofired ceramic substrates, microassembly technique, module packaging, multilayer structures, optoelectronic chips, packaging-induced thermomechanical stresses, passive alignment, passive assembly, photonic components, precision 3D structures, short external cavity configuration, silicon surface",
author = "Veli Heikkinen and Janne Aikio and Teemu Alajoki and Kari Kautio and Jyrki Ollila and Pentti Karioja",
year = "2005",
doi = "10.1109/TADVP.2004.841664",
language = "English",
volume = "28",
pages = "121 -- 127",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronic Engineers IEEE",
number = "1",

}

Wavelength-tunable laser module using low-temperature cofired ceramic substrates. / Heikkinen, Veli (Corresponding Author); Aikio, Janne; Alajoki, Teemu; Kautio, Kari; Ollila, Jyrki; Karioja, Pentti.

In: IEEE Transactions on Advanced Packaging, Vol. 28, No. 1, 2005, p. 121 - 127.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Wavelength-tunable laser module using low-temperature cofired ceramic substrates

AU - Heikkinen, Veli

AU - Aikio, Janne

AU - Alajoki, Teemu

AU - Kautio, Kari

AU - Ollila, Jyrki

AU - Karioja, Pentti

PY - 2005

Y1 - 2005

N2 - We realized a prototype series of the 1550-nm band wavelength-tunable laser module. The edge-emitting Fabry-Perot diode laser operates in the short external cavity configuration and is tuned by a silicon surface micromachined Fabry-Peacuterot interferometer device. Low-temperature cofired ceramic (LTCC) substrate technology was used in the module packaging to enable the passive alignment of the photonic components. Low conductor resistance and dielectric loss, multilayer structures with fine-line capability, compatibility with hermetic sealing, and the ability to integrate passive electrical components (resistors, capacitors, and inductors) into the substrate make LTCC a useful technology for telecommunication applications. In addition, the fair match of the thermal expansion coefficient to optoelectronic chips reduces packaging-induced thermomechanical stresses. The precision three-dimensional (3-D) structures, such as cavities, holes, and channels manufactured in the ceramic parts, ease the packaging process via the passive assembly. The wavelength tuning range of the realized modules ranged from 8 to 19 nm and single-mode fiber-coupled output power was between 100 and 570 muW. The hybrid arrangement uses standard laser chips and, therefore, potentially provides a cost-effective and easily configurable solution for last-mile fiber optic communications.

AB - We realized a prototype series of the 1550-nm band wavelength-tunable laser module. The edge-emitting Fabry-Perot diode laser operates in the short external cavity configuration and is tuned by a silicon surface micromachined Fabry-Peacuterot interferometer device. Low-temperature cofired ceramic (LTCC) substrate technology was used in the module packaging to enable the passive alignment of the photonic components. Low conductor resistance and dielectric loss, multilayer structures with fine-line capability, compatibility with hermetic sealing, and the ability to integrate passive electrical components (resistors, capacitors, and inductors) into the substrate make LTCC a useful technology for telecommunication applications. In addition, the fair match of the thermal expansion coefficient to optoelectronic chips reduces packaging-induced thermomechanical stresses. The precision three-dimensional (3-D) structures, such as cavities, holes, and channels manufactured in the ceramic parts, ease the packaging process via the passive assembly. The wavelength tuning range of the realized modules ranged from 8 to 19 nm and single-mode fiber-coupled output power was between 100 and 570 muW. The hybrid arrangement uses standard laser chips and, therefore, potentially provides a cost-effective and easily configurable solution for last-mile fiber optic communications.

KW - Fabry-Perot interferometers

KW - ceramic packaging

KW - packaging

KW - integrated optoelectronics

KW - laser tuning

KW - microassembly

KW - semiconductor lasers

KW - conductor resistance

KW - dielectric loss

KW - fiber optic communications

KW - fine-line capability

KW - hermetic sealing

KW - hybrid integrated circuit packaging

KW - integrated passive electrical components

KW - laser chips

KW - low-temperature cofired ceramic substrates

KW - microassembly technique

KW - module packaging

KW - multilayer structures

KW - optoelectronic chips

KW - packaging-induced thermomechanical stresses

KW - passive alignment

KW - passive assembly

KW - photonic components

KW - precision 3D structures

KW - short external cavity configuration

KW - silicon surface

U2 - 10.1109/TADVP.2004.841664

DO - 10.1109/TADVP.2004.841664

M3 - Article

VL - 28

SP - 121

EP - 127

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

SN - 1521-3323

IS - 1

ER -