Wavelength-tunable laser module using low-temperature cofired ceramic substrates

Veli Heikkinen (Corresponding Author), Janne Aikio, Teemu Alajoki, Kari Kautio, Jyrki Ollila, Pentti Karioja

    Research output: Contribution to journalArticleScientificpeer-review

    4 Citations (Scopus)


    We realized a prototype series of the 1550-nm band wavelength-tunable laser module. The edge-emitting Fabry-Perot diode laser operates in the short external cavity configuration and is tuned by a silicon surface micromachined Fabry-Peacuterot interferometer device. Low-temperature cofired ceramic (LTCC) substrate technology was used in the module packaging to enable the passive alignment of the photonic components. Low conductor resistance and dielectric loss, multilayer structures with fine-line capability, compatibility with hermetic sealing, and the ability to integrate passive electrical components (resistors, capacitors, and inductors) into the substrate make LTCC a useful technology for telecommunication applications. In addition, the fair match of the thermal expansion coefficient to optoelectronic chips reduces packaging-induced thermomechanical stresses. The precision three-dimensional (3-D) structures, such as cavities, holes, and channels manufactured in the ceramic parts, ease the packaging process via the passive assembly. The wavelength tuning range of the realized modules ranged from 8 to 19 nm and single-mode fiber-coupled output power was between 100 and 570 muW. The hybrid arrangement uses standard laser chips and, therefore, potentially provides a cost-effective and easily configurable solution for last-mile fiber optic communications.
    Original languageEnglish
    Pages (from-to)121 - 127
    Number of pages7
    JournalIEEE Transactions on Advanced Packaging
    Issue number1
    Publication statusPublished - 2005
    MoE publication typeA1 Journal article-refereed


    • Fabry-Perot interferometers
    • ceramic packaging
    • packaging
    • integrated optoelectronics
    • laser tuning
    • microassembly
    • semiconductor lasers
    • conductor resistance
    • dielectric loss
    • fiber optic communications
    • fine-line capability
    • hermetic sealing
    • hybrid integrated circuit packaging
    • integrated passive electrical components
    • laser chips
    • low-temperature cofired ceramic substrates
    • microassembly technique
    • module packaging
    • multilayer structures
    • optoelectronic chips
    • packaging-induced thermomechanical stresses
    • passive alignment
    • passive assembly
    • photonic components
    • precision 3D structures
    • short external cavity configuration
    • silicon surface


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