Abstract
We realized a prototype series of the 1550-nm band wavelength-tunable
laser module. The edge-emitting Fabry-Perot diode laser operates in the
short external cavity configuration and is tuned by a silicon surface
micromachined Fabry-Peacuterot interferometer device. Low-temperature
cofired ceramic (LTCC) substrate technology was used in the module
packaging to enable the passive alignment of the photonic components.
Low conductor resistance and dielectric loss, multilayer structures with
fine-line capability, compatibility with hermetic sealing, and the
ability to integrate passive electrical components (resistors,
capacitors, and inductors) into the substrate make LTCC a useful
technology for telecommunication applications. In addition, the fair
match of the thermal expansion coefficient to optoelectronic chips
reduces packaging-induced thermomechanical stresses. The precision
three-dimensional (3-D) structures, such as cavities, holes, and
channels manufactured in the ceramic parts, ease the packaging process
via the passive assembly. The wavelength tuning range of the realized
modules ranged from 8 to 19 nm and single-mode fiber-coupled output
power was between 100 and 570 muW. The hybrid arrangement uses standard
laser chips and, therefore, potentially provides a cost-effective and
easily configurable solution for last-mile fiber optic communications.
Original language | English |
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Pages (from-to) | 121 - 127 |
Number of pages | 7 |
Journal | IEEE Transactions on Advanced Packaging |
Volume | 28 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2005 |
MoE publication type | A1 Journal article-refereed |
Keywords
- Fabry-Perot interferometers
- ceramic packaging
- packaging
- integrated optoelectronics
- laser tuning
- microassembly
- semiconductor lasers
- conductor resistance
- dielectric loss
- fiber optic communications
- fine-line capability
- hermetic sealing
- hybrid integrated circuit packaging
- integrated passive electrical components
- laser chips
- low-temperature cofired ceramic substrates
- microassembly technique
- module packaging
- multilayer structures
- optoelectronic chips
- packaging-induced thermomechanical stresses
- passive alignment
- passive assembly
- photonic components
- precision 3D structures
- short external cavity configuration
- silicon surface