Keyphrases
Low Temperature Co-fired Ceramic
100%
Ceramic Substrate
100%
Laser Module
100%
Multi-wavelength Light Source
100%
3D Structure
33%
Diode Laser
33%
Capacitors
33%
Resistors
33%
Packaging Process
33%
Single-mode Fiber
33%
Power Output
33%
Interferometer
33%
Multilayer Structure
33%
Silicon Surface
33%
Surface Micromachining
33%
Coefficient of Thermal Expansion
33%
Fabry
33%
Last Mile
33%
Resistance Loss
33%
Inductors
33%
Wavelength Tuning Range
33%
Photonic Components
33%
Passive Alignment
33%
Optoelectronic chip
33%
Dielectric Loss
33%
Thermo-mechanical Stress
33%
Fabry-Perot
33%
Hermetic Sealing
33%
Fiber-coupled
33%
Ceramic Components
33%
Substrate Technology
33%
Fine Line
33%
Cavity Configuration
33%
External Cavity
33%
Electrical Components
33%
Laser chip
33%
Module Packaging
33%
Conductor Resistance
33%
Telecommunication Applications
33%
Hybrid Arrangement
33%
Optical Fiber Communication
33%
Coupling Output
33%
Edge Emitting
33%
Passive Assembly
33%
INIS
substrates
100%
low temperature
100%
ceramics
100%
wavelengths
100%
lasers
100%
packaging
75%
cavities
50%
layers
25%
output
25%
solutions
25%
fibers
25%
surfaces
25%
applications
25%
hybrids
25%
cost
25%
devices
25%
silicon
25%
power
25%
losses
25%
range
25%
configuration
25%
holes
25%
precision
25%
dielectrics
25%
tuning
25%
alignment
25%
interferometers
25%
thermal expansion
25%
capacitors
25%
compatibility
25%
fiber optics
25%
resistors
25%
inductors
25%
Engineering
Low-Temperature
100%
Laser Module
100%
Dimensional Structure
33%
Silicon Surface
33%
Output Power
33%
Expansion Coefficient
33%
External Cavity
33%
Telecommunication
33%
Photonics
33%
Optoelectronics
33%
Single Mode Fibers
33%
Fabry Perot
33%
Laser Chip
33%
Fiber-Optic Communication
33%
Dielectric Loss
33%
Material Science
Ceramic Substrate
100%
Conductor
50%
Interferometer
50%
Fiber-Optic Communication
50%
Electrical Component
50%
Capacitor
50%
Semiconductor Laser
50%
Silicon
50%
Surface (Surface Science)
50%
Thermal Expansion
50%
Dielectric Material
50%