Abstract
A hybrid millimeter-wave Wilkinson divider comprises an input port (1), a first output port (2), a second output port (3), and transmission lines connecting the input port (1) to the first and second output ports (2, 3) implemented by transmission lines in a carrier substrate (PCB, 31). An isolation resistor of the Wilkinson divider connected between the first and second output ports (2, 3) is integrated in a monolithic micro-wave integrated circuit (MMIC) chip (40) installed on the carrier substrate. On the MMIC chip the isolation resistor is connected between RF input metal pads. A compensation circuit for parasitic capacitances caused by the RF input metal pads is provided on the MMIC chip (40) so that the on-chip resistor appears as a pure resistance to the output ports (2, 3) of the Wilkinson divider on the carrier substrate (PCB, 31).
Patent family as of 2.2.2026
Patent family as of 2.2.2026
Publication number Publication dateApplication numberApplication date
US2022166122 AAClaims May 26, 2022 US20210440523 Mar 17, 2020
US12142808 BBClaims Nov 12, 2024 US20210440523 Mar 17, 2020
WO20188146 A1Claims Sep 24, 2020 WO2020FI50165 Mar 17, 2020
EP3942605 A1Claims Jan 26, 2022 EP20200715940 Mar 17, 2020
CN113632224 AClaims Nov 9, 2021 CN202080021818 Mar 17, 2020
CN113632224 BClaims Aug 26, 2025 CN202080021818 Mar 17, 2020
FI20195200 AClaims Sep 19, 2020 FI20190005200 Mar 18, 2019
FI130081 BClaims Jan 31, 2023 FI20190005200 Mar 18, 2019
KR20210134913 AClaims Nov 11, 2021 KR20217029803 Mar 17, 2020
KR102819996 B1Claims Jun 13, 2025 KR20217029803 Mar 17, 2020
| Original language | English |
|---|---|
| Patent number | US12142808 B2 |
| Priority date | 17/03/20 |
| Filing date | 17/03/20 |
| Publication status | Published - 12 Nov 2024 |
| MoE publication type | H1 Granted patent |