ZnO for thin film BAW devices

Jyrki Molarius, Tuomas Pensala, Arto Nurmela, Markku Ylilammi, A. Dommann

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

As a test vehicle to measure the piezoelectricity of zinc oxide films, bulk acoustic wave (BAW) re-sonators were fabricated using standard microelectronics deposition, photolithography, and etching tech-niques on 100 mm Corning glass or silicon wafers. Resonators and filters were of solidly mounted re-sonator (SMR) type. The acoustic quarter wavelength mirror consisted of high and low acoustic impe-dance materials, which were either three pairs of molybdenum and silicon dioxide or two pairs of tungs-ten and silicon dioxide, respectively. Mirrors were designed for 1 and 2 GHz frequencies. Material pro-perties of the zinc oxide films have been studied by x-ray diffraction (including rocking curve), scanning electron microscopy and atomic force microscopy. Resonators were measured from 0.5 to 6 GHz using network analyzer. The highest acoustic coupling coefficient, K2 = 10.4% at 1.6 GHz, for thin film zinc oxide was achieved. Also a passband filter, fulfilling the complete E-GSM specifications, was fabricated using zinc oxide piezoelectric in the resonators.
Original languageEnglish
Title of host publicationProceedings of the IEEE Ultrasonics Symposium 2005
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1816-1819
ISBN (Print)0-7803-9382-1
DOIs
Publication statusPublished - 2005
MoE publication typeA4 Article in a conference publication
EventIEEE Ultrasonics Symposium - Rotterdam, Netherlands
Duration: 18 Sep 200521 Sep 2005

Conference

ConferenceIEEE Ultrasonics Symposium
CountryNetherlands
CityRotterdam
Period18/09/0521/09/05

Keywords

  • ZnO
  • BAW
  • FBAR
  • SMR
  • high acoustic coupling

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  • Cite this

    Molarius, J., Pensala, T., Nurmela, A., Ylilammi, M., & Dommann, A. (2005). ZnO for thin film BAW devices. In Proceedings of the IEEE Ultrasonics Symposium 2005 (pp. 1816-1819). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ULTSYM.2005.1603221