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• LTCC technology for photonic and millimeter wave module integration

  Keränen, K., Karppinen, M., Lenkkeri, J., Mäkinen, J.-T., Ollila, J. & Karioja, P., 2005, In: International Journal of Software Engineering and Knowledge Engineering. 15, 2, p. 215 - 224 10 p.

  Research output: Contribution to journal › Article › Scientific › peer-review

  1   Link opens in a new tab Citation (Scopus)

• Multichannel VCSEL-based optical transceiver employing multicore fibers at 6x25 Gbps/fiber

  Karppinen, M., Tanskanen, A., Ollila, J., Gustavsson, J., Larsson, A., Ko, M., Kissinger, D., Grüner-Nielsen, L., Safaisini, R., Maho, A., Sotom, M. & Stampoulidis, L., 14 Mar 2018, Optical Interconnects XVIII. International Society for Optics and Photonics SPIE, 105380C. (Proceedings of SPIE, Vol. 10538).

  Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific

• MEMS, MOEMS, RF-MEMS and photonics packaging based on LTCC technology

  Karioja, P., Kautio, K., Ollila, J., Keränen, K., Karppinen, M., Heikkinen, V., Jaakola, T. & Lahti, M., 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC 2014). IEEE Institute of Electrical and Electronic Engineers, 6 p.

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  9   Link opens in a new tab Citations (Scopus)

• Packaging of Photonic Integrated Circuits: Extended Abstract

  Karppinen, M., 2023, 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2023). IEEE Institute of Electrical and Electronic Engineers, 2 p.

  Research output: Chapter in Book/Report/Conference proceeding › Conference abstract in proceedings › Scientific

• Scalable electro-photonic integration concept based on polymer waveguides

  Bosman, E., Van Steenberge, G., Boersma, A., Wiegersma, S., Harmsma, P., Karppinen, M., Korhonen, T., Offrein, B. J., Dangel, R., Daly, A., Ortsiefer, M., Justice, J., Corbett, B., Dorrestein, S. & Duis, J., 1 Jan 2016, Optical Interconnects XVI. Schröder, H. & Chen, R. T. (eds.). International Society for Optics and Photonics SPIE, 97530G. (Proceedings of SPIE, Vol. 9753).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

• Low temperature co-fired ceramics on optoelectronic sensors integration

  Moilanen, V., Kautio, K., Karioja, P., Rikola, R., Lehtomaa, J. & Malinen, J., 2007, Optical Sensing Technology and Applications. International Society for Optics and Photonics SPIE, (Proceedings of SPIE, Vol. 6585).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  1   Link opens in a new tab Citation (Scopus)

• Fiber pigtailed multimode laser module based on passive device alignment on an LTCC substrate

  Keränen, K., Mäkinen, J.-T., Kautio, K. T., Ollila, J., Petäjä, J., Heikkinen, V., Heilala, J. & Karioja, P., 2006, In: IEEE Transactions on Advanced Packaging. 29, 3, p. 463-472 10 p.

  Research output: Contribution to journal › Article › Scientific › peer-review

  6   Link opens in a new tab Citations (Scopus)

• Cost-effective packaging of laser modules using LTCC substrates

  Keränen, K., Mäkinen, J.-T., Heilala, J., Väätäinen, O., Kautio, K., Ollila, J., Petäjä, J., Karppinen, M., Heikkinen, V. & Karioja, P., 2004, Photonics Packaging and Integration IV. International Society for Optics and Photonics SPIE, p. 111-121 (Proceedings of SPIE, Vol. 5358).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  9   Link opens in a new tab Citations (Scopus)

• Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results

  Vervaeke, M., Lahti, M., Karppinen, M., Debaes, C., Volckaerts, B., Karioja, P. & Thienpont, H., 2006, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, p. 201-213 (Proceedings of SPIE, Vol. 6185).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  4   Link opens in a new tab Citations (Scopus)

• Packaging considerations of fiber optic laser sources

  Heikkinen, V., Tukkiniemi, K., Vähäkangas, J. & Hannula, T., 1991, Optomechanics and Dimensional Stability. Paquin, R. A. & Vukobratovich, D. (eds.). International Society for Optics and Photonics SPIE, p. 115-121 (Proceedings of SPIE, Vol. 1533).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  45   Link opens in a new tab Citations (Scopus)

• Optical transceivers for interconnections in satellite payloads

  Karppinen, M., Heikkinen, V., Juntunen, E., Kautio, K., Ollila, J., Sitomaniemi, A. & Tanskanen, A., 2013, Optoelectronic Interconnects XIII. Glebov, A. L. & Chen, R. T. (eds.). International Society for Optics and Photonics SPIE, 86300F. (Proceedings of SPIE, Vol. 8630).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  2   Link opens in a new tab Citations (Scopus)

• Cost-efficient hermetic fibre pigtailed laser module utilizing passive device alignment on an LTCC substrate

  Keränen, K., Ollila, J., Mäkinen, J.-T., Kautio, K., Korhonen, P., Heikkinen, V., Väätäinen, O., Heilala, J. & Karioja, P., 2006, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, (Proceedings of SPIE, Vol. 6185).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  1   Link opens in a new tab Citation (Scopus)

• Development and scalability of a 2 Tb/s data transmission module based on a3 μm SOI silicon photonics platform

  Delrosso, G. & Bhat, S., 2020, 22nd International Conference on Transparent Optical Networks (ICTON 2020). IEEE Institute of Electrical and Electronic Engineers, 5 p. (International Conference on Transparent Optical Networks, Vol. 22).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  10   Link opens in a new tab Citations (Scopus)

• Review of LTCC Technology for Millimeter Waves and Photonics

  Lahti, M., Kautio, K., Karppinen, M., Ollila, J., Keränen, K. & Karioja, P., 1 Jun 2020, In: International Journal of Electronics and Telecommunications. 66, 2, p. 361-367

  Research output: Contribution to journal › Article › Scientific › peer-review

  Open Access

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• Heterogeneous integration of VCSELs on 3 µm SOI silicon photonics platform with up-reflecting mirrors

  Delrosso, G., Lee, J.-W., Wälchli, B., Bhat, S., Neumeyr, C. & Aalto, T., 5 Mar 2022, Optical Interconnects XXII. Chen, R. T. & Schroder, H. (eds.). International Society for Optics and Photonics SPIE, 9 p. 120070J. (Proceedings of SPIE, Vol. 12007).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  1   Link opens in a new tab Citation (Scopus)

• Microsystem integration from RF to millimeter wave applications

  Vähä-Heikkilä, T. & Lahti, M., 2015, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems. Sánchez-Rojas, J. L. & Brama, R. (eds.). International Society for Optics and Photonics SPIE, 95170R. (Proceedings of SPIE, Vol. 9517).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  1   Link opens in a new tab Citation (Scopus)

• Si photonics using micron-size waveguides

  Aalto, T., Cherchi, M., Harjanne, M., Sun, F., Vehmas, T., Bhat, S., Kapulainen, M., Hokkanen, A., Lehtimäki, L., Holmberg, H. & Haapalinna, A., 27 Feb 2019, Optical Components and Materials XVI. Digonnet, M. J. F. & Jiang, S. (eds.). International Society for Optics and Photonics SPIE, 12 p. 109140B. (Proceedings of SPIE, Vol. 10914).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  1   Link opens in a new tab Citation (Scopus)

• In-line Vector Modulator Integration in Dielectric-filled Waveguide

  Haarla, J., Ala-Laurinaho, J., Lahti, M., Varonen, M., Kantanen, M., Holmberg, J. & Viikari, V., 1 Feb 2023, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13, 2, p. 153-160 8 p.

  Research output: Contribution to journal › Article › Scientific › peer-review

  Open Access

  2   Link opens in a new tab Citations (Scopus)

• Cryogenic characterization of LTCC material in Millimeter-Wave Frequencies

  Vargas-Millalonco, F., Martinez-Ledesma, M., Reeves, R., Rodriguez, R., Paaso, J., Lahti, M., Kaunisto, M. & Varonen, M., 1 Jun 2024, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 14, 6, p. 1007-1014 8 p.

  Research output: Contribution to journal › Article › Scientific › peer-review

  3   Link opens in a new tab Citations (Scopus)

• Differential photoacoustic gas cell based on LTCC for ppm gas sensing

  Keränen, K., Kautio, K., Ollila, J., Heikkinen, M., Kauppinen, I., Kuusela, T., Matveev, B., McNie, M. E., Jenkins, R. M. & Karioja, P., 2010, Proceedings of the SPIE : Optoelectronic Interconnects and Component Integration IX. International Society for Optics and Photonics SPIE, 12 p. 760714. (Proceedings of SPIE, Vol. 7607).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  2   Link opens in a new tab Citations (Scopus)

• Silicon-Micromachined Waveguide Systems as a Packaging Solution for sub -THz and THz Active Circuits

  Ermolov, V., Lamminen, A., Varonen, M., Ailas, H., Lahti, M., Forstén, H., Kaunisto, M., Kantanen, M., Parveg, D. & Pursula, P., 26 Sept 2024, 2024 54th European Microwave Conference (EuMC). Wiley-IEEE Press, p. 581-584 4 p. 10732737

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

• Integrated multi-wavelength Mid-IR light source for gas sensing

  Karioja, P., Alajoki, T., Cherchi, M., Ollila, J., Harjanne, M., Heinilehto, N., Suomalainen, S., Zia, N., Tuorila, H., Viheriälä, J., Guina, M., Buczynski, R., Kasztelanic, R., Salo, T., Virtanen, S., Kluczynski, P., Borgen, L., Ratajczyk, M. & Kalinowski, P., 2018, Next-Generation Spectroscopic Technologies XI. Druy, M. A., Barnett, S. M., Profeta, L. T. M., Crocombe, R. A. & Azad, A. K. (eds.). International Society for Optics and Photonics SPIE, 9 p. 106570A. (Proceedings of SPIE, Vol. 10657).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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• Optically pumped magnetometer arrays for magnetoencephalography (OPMMEG)

  Lahti, M., 2024, 60th Annual Microelectronics and Packaging Conference and Exhibition (NordPac 2024). IMAPS Nordic

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

• Optical coupling structure made by imprinting between single-mode polymer waveguide and embedded VCSEL

  Karppinen, M., Salminen, N., Korhonen, T., Alajoki, T., Petäjä, J., Bosman, E., Van Steenberge, G., Justice, J., Khan, U., Corbett, B. & Boersma, A., 2015, Optical Interconnects XV: 93680H. International Society for Optics and Photonics SPIE, (Proceedings of SPIE, Vol. 9368).

  Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

  6   Link opens in a new tab Citations (Scopus)

• Life cycle assessment of a new smart label for intelligent packaging

  Sokka, L., Välimäki, M., Väisänen, K.-L., Keskinen, J., Hakola, E., Mäntysalo, M., Ollila, J., Happonen, T., Hakola, L. & Smolander, M., 1 Mar 2024, In: Flexible and Printed Electronics. 9, 1, 015007.

  Research output: Contribution to journal › Article › Scientific › peer-review

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  13   Link opens in a new tab Citations (Scopus)

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